Doom isn't CPU intensive and a benchmark even PD does far better than usual in.Optimistic : Thats fantastic, cant wait to hear more.
Pessimistic : Just shows its ISA compliant. Lets hope it doesnt crash.
Doom isn't CPU intensive and a benchmark even PD does far better than usual in.
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(Opinions are own)
It's 8 pm in LA. Have they demoed Doom yet?
its a well threaded benchmark doesn't mean it isn't CPU intensive
So they demoed a working sample of Zen that didnt crash running DOOM. It is not nothing.
BTW is it normal to have no labels on the ES chips at all? :sneaky:It would be pretty bad if final silicon did that D:
BTW is it normal to have no labels on the ES chips at all? :sneaky:
Yep, like this (from the video):ALL of the lasering missing (completely blank)?
I've had such production silicon, but they are for special purpose only. It can be used as a safety measure, since unless you have the right equipment and info, the CPU is nothing but a paper weight :sneaky:
OK, thanks. Interesting. Where can I get one?Thanks.
If you look where the lady is putting the trays into, it becomes pretty obvious why they are blank chips
Unfused and unmarked parts about to be fused and marked.
Thanks.
If you look where the lady is putting the trays into, it becomes pretty obvious why they are blank chips
Unfused and unmarked parts about to be fused and marked.
No, they won't.
Thanks for adding to the conversation with insightful facts and knowledge.
http://www.eetimes.com/author.asp?section_id=36&doc_id=1329887IBM's processes, including 14nm SOI, are typically quite exotic. The wafers tend to be expensive, yields aren't great, and so on. This is one of the reasons that IBM never really gained much traction as a general purpose foundry, and why they ultimately paid GloFo to take the fabs.
GloFo, as part of a wafer supply agreement with IBM, will continue to run IBM's exotic processes in its newly acquired fabs for the POWER chips. But it is very unlikely that third party fabless customers will want in on the fabs.
A good clue here is that in recent presentations around OpenPOWER, IBM and its partners have talked about POWER-derivative chips from partners being built by third party manufacturing houses rather than on IBM's old fabs now owned by GloFo.
Anyway, no way AMD is going to use these expensive, low-yielding, and probably difficult to design for processes for future CPUs or GPUs.
I think that AMD will use this(FD-SOI) process for both Zen AND Vega GPUs.
FinFET technology is expected to play a critical foundational role across multiple AMD product lines, starting in 2016, said Mark Papermaster, senior vice president and chief technology officer at AMD. GLOBALFOUNDRIES has worked tirelessly to reach this key milestone on its 14LPP process. We look forward to GLOBALFOUNDRIES' continued progress towards full production readiness and expect to leverage the advanced 14LPP process technology across a broad set of our CPU, APU, and GPU products.
http://www.eetimes.com/author.asp?section_id=36&doc_id=1329887
I suppose you have not read this article on the matter of production costs between processes.
I think that AMD will use this(FD-SOI) process for both Zen AND Vega GPUs.
That article is terrible!!
As one responder points out, 14nm FD-SOI is still in development - so it's yields are not yet known (which invalidates any cost metric).
http://www.eetimes.com/author.asp?section_id=36&doc_id=1329887
I suppose you have not read this article on the matter of production costs between processes.
I think that AMD will use this(FD-SOI) process for both Zen AND Vega GPUs.