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Discussion in 'CPUs and Overclocking' started by Dresdenboy, Mar 1, 2016.
Officially? JEDEC specs.
There is a paper, that dates to Carrizo, in which the positions on the die was investigated. It turns out that putting the most consuming parts (FPUs and core in general) toward the centre of the die, let you gain up to 5 degrees. So the positioning is not casual, i think...
A common reason for more rectangular dies is that the IO wants to be on the edges and as you add IO to a die you want to increase the circumference. As visible on the picture, Ryzen has a crapload of IO structures on the edges. Maybe they wouldn't fit with a more square die? (Although, the left edge is almost clear of IO.)
I mean, officially it would be JEDEC spec, but reviewers are being given 3000MHz kits. So I don't think we should worry about memory support.
Well, if they are only giving 3000Mhz kits then maybe we should. Though Biostar did get 3600Mhz B-die validated, so it is probably fine up until 3400.
I wouldn't worry anyway, given DRAM prices nowadays