New Zen microarchitecture details

Discussion in 'CPUs and Overclocking' started by Dresdenboy, Mar 1, 2016.

  1. Veradun

    Veradun Member

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    Officially? JEDEC specs.
     
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  2. bjt2

    bjt2 Senior member

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    There is a paper, that dates to Carrizo, in which the positions on the die was investigated. It turns out that putting the most consuming parts (FPUs and core in general) toward the centre of the die, let you gain up to 5 degrees. So the positioning is not casual, i think...
     
  3. Tuna-Fish

    Tuna-Fish Senior member

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    A common reason for more rectangular dies is that the IO wants to be on the edges and as you add IO to a die you want to increase the circumference. As visible on the picture, Ryzen has a crapload of IO structures on the edges. Maybe they wouldn't fit with a more square die? (Although, the left edge is almost clear of IO.)
     
  4. CatMerc

    CatMerc Senior member

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    I mean, officially it would be JEDEC spec, but reviewers are being given 3000MHz kits. So I don't think we should worry about memory support.
     
  5. lolfail9001

    lolfail9001 Senior member

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    Well, if they are only giving 3000Mhz kits then maybe we should. Though Biostar did get 3600Mhz B-die validated, so it is probably fine up until 3400.
     
  6. Veradun

    Veradun Member

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    I wouldn't worry anyway, given DRAM prices nowadays :D