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Discussion Zen 5 Speculation (EPYC Turin and Strix Point/Granite Ridge - Ryzen 9000)

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FlameTail said:
CAMM is a form factor. Why does it have numbered variants??

We didn't have SO-DIMM1, SO-DIMM2, SO-DIMM3 right?
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CAMM is a proprietary standard developed by Dell.

CAMM2 is a JEDEC standard based on CAMM that anyone can implement.

Sort of like switching up from AMD/DICE's Mantle to the Khronos Vulkan API standard for low level graphics programming which was directly based on Mantle with input from the hardware and software industries.
 
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soresu said:
CAMM is a proprietary standard developed by Dell.

CAMM2 is a JEDEC standard based on CAMM that anyone can implement - sort of like switching up from AMD/DICE's Mantle to the Khronos Vulkan API standard for low level graphics programming which was directly based on Mantle with input from the hardware and software industries.
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3 minutes faster than I 🙂
 
Why is the added latency of LPDDR a problem for PC enthusiasts?

Apple Silicon Macs use LPDDR with no issue.

I suppose it has to do with the different design paradigms. Intel/AMD CPUs are designed to run at higher clock speeds, and are hence more latency sensitive.
 
FlameTail said:
Why is the added latency of LPDDR a problem for PC enthusiasts?

Apple Silicon Macs use LPDDR with no issue.

I suppose it has to do with the different design paradigms. Intel/AMD CPUs are designed to run at higher clock speeds, and are hence more latency sensitive.
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Gaming... One of the reasons why X3D is so successful 🙂
 
maddie said:
Zen 2 is also quite small. If it provides enough CPU capability to exploit the GPU segment, then why change?
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Imagine the size of it on N3. (not saying anything, just that the die would be super small.)

adroc_thurston said:
Yeah, that's the point.
You screw it in and a-ha! it works.
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Not only that, but it could potentially go on the back side of the motherboard and that would save a ton of space. PCs gonna get smaller, yo!
 
adroc_thurston said:
the platform is fixed in place.
Nothing to see.

It still heats up and needs cooling. So no you don't.
It's just a smaller, neater form-factor for client memory.
(frankly, DIMMs kinda suck a fat one in general)
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Case manufacturers are already accounting for this in new and future designs. Shoot. some manufacturers are already including extra space for backside power connectors.

I would dig up some links, but I am on mobile rn.
 
eek2121 said:
Case manufacturers are already accounting for this in new and future designs
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Can't do that, you're ATX-limited.
eek2121 said:
some manufacturers are already including extra space for backside power connectors.
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That's not dissipating any real heat.
soresu said:
It depends entirely on your use case.
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The usecase for DIY DT PC is gaming.
LPDDR is sorta a mixed bag there; higher net (and I think effective) bandwidth but latency is measurably (very much so) worse.
 
soresu said:
Seems like a modern overhaul of overall PC system design is long overdue.
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I prefer something like easy to plug rectangular modules. Everything covered with a plastic shroud to protect the internal electronics and having microchannel spaces in the plastic for airflow. Make it so easy that a five year old can assemble their own PC.
 
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