All the talks on reddit are about it being a custom APU potentially for Apple. So far none of the AMD CPU-Apple rumors became true.I don't know, but the driver code don't lie. Van Gogh is heavily based off of Renoir, but is gfx1030.
Apparently Komachi did a write up on Reddit: https://www.reddit.com/user/Komachi_ENSAKA/comments/ea7rm3/van_gogh_is_first_rdna_gfx10_apu/
In any case it's the next low power ("value mobile") APU, in line with Raven2 indeed.Dali is 2c 4t, heavily based off of RAVEN2.
Probably just an updated media and display engine, still Zen or maybe Zen+ now.
"Dali is a new asic revision based on raven2" => https://lists.freedesktop.org/archives/amd-gfx/2019-September/039776.html'Dali is an ASIC based off of RAVEN2'.
It'll take me a while to find it again, but it's pretty cut and dry what Dali is.
Workgroup Processors, or WGP's is AMD's terminology.4 Dual-CUs?
Workgroup Processors, or WGP's is AMD's terminology.
Now somebody is speculating that Renoir might be a 12 or 13 CU part, which by the names they found in the product master list implies an octacore APU (with Ryzen9 flashship in mobile and Ryzen7 flagship on AM4). The AM4 desktop TDP's range from 35W to 65W while the notebook parts range from 15W to 45W, including a 15W mobile (implied) octacore.
This 15W top bin 8c would probably be hard to do if Renoir was an MCM (with IO hub integrated into the iGPU and re-use of the existing 8c chiplets), even if the GPU/IO chiplet is on 7nm. So most likely that's gotta be monolithic with halved L3 (possibly quartered).
Sounds like a very nice line of products right there, wow.
Now somebody is speculating that Renoir might be a 12 or 13 CU part, which by the names they found in the product master list implies an octacore APU (with Ryzen9 flashship in mobile and Ryzen7 flagship on AM4). The AM4 desktop TDP's range from 35W to 65W while the notebook parts range from 15W to 45W, including a 15W mobile (implied) octacore.
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The BXX numbering is more likely to be a performance tier instead of directly relating to CU count. Every leak before has said 16-20cu and on a process shrink the compute units are going to shrink very well so I don't think they'll cut that many.
My crazy out there guess is that B12 is a new performance tier brought about by the new fp6 socket allowing some kind of on package memory or lpddr4 which is why the am4 parts don't have that. I was even wondering if a 64bit gddr6 2x package would be easier to achieve than an HBM package, as that low bandwidth cheap non-interposer hbm2 never appeared. FP6 is a new socket and hopefully offers something good, budget designs could just skimp on the features like they usually do.
There's been no news about renoir MCM and there's not really a point in gimping the l3 cache if they use the current ccd. I'm more curious about how much extra die space would be needed on an IO/gpu die if the single cpu complex is separate. epyc2 and ryzen3000 have a huge amount of die space because of that and I don't think a mainstream soc would manage all of that extra space.
There is low hanging fruit! MCM without I/O die.
209.78 = RV0 * (331(RVII) / 486(RX64)) => 142 mm2
77+77+125 = 279 mm2 <-- One IOD + Two CCDs
142+142 = 284 mm2 <-- Two Monolithic dies interconnected via Renoir's EPYC(Zeppelin)-style Infinity Fabric.
Allowing for 8-cores, 24 CUs(12 CU+12 CU)((Up 20% from 10 CUs each)), 256-bit DDR4 memory, 2x VCN load, etc.
It is 100% monolithic. While, also capable of using the Infinity Fabric integrated in Renoir for IFOP to another monolithic Renoir die.Renoir is 100% monolithic.
It is 100% monolithic. While, also capable of using the Infinity Fabric integrated in Renoir for IFOP to another monolithic Renoir die.
There is no issues with power, since the actual increase isn't massive. The die isn't going from 4c to 8c or 10 cu to 20 cu. So, it can maximize on the >50% lower power.
Ryzen 3700u => 15W, two Renoir dies of the same clock speed => 6.5W+6.5W = ~15W
Now somebody is speculating that Renoir might be a 12 or 13 CU part, which by the names they found in the product master list implies an octacore APU (with Ryzen9 flashship in mobile and Ryzen7 flagship on AM4). The AM4 desktop TDP's range from 35W to 65W while the notebook parts range from 15W to 45W, including a 15W mobile (implied) octacore.
This 15W top bin 8c would probably be hard to do if Renoir was an MCM (with IO hub integrated into the iGPU and re-use of the existing 8c chiplets), even if the GPU/IO chiplet is on 7nm. So most likely that's gotta be monolithic with halved L3 (possibly quartered).
Sounds like a very nice line of products right there, wow.
- Picasso 15D8_REV_CD AMD Radeon(TM) Vega 2 Graphics
- Picasso 15D8_REV_93 AMD Radeon(TM) Vega 1 Graphics
How so?If is Vega, is a downgrade.
Sounds like a downgrade to me [....]
6 CUs for Ryzen 3
3-4CUs for probably another Athlon.
Not really. I would say 12-13CU for the octacores (Ryzen9mobile, Ryzen7DT) and some Ryzen7mobile.
11-8CU for the hexacores (which range from Ryzen5 DT and Ryzen5-7 mobile) and lower bin 8c Ryzen7 DT.
3-6CU for the few rare quadcore parts and other bottom bin parts.
And Vega frequencies would be at least 10% higher (usually ~20% higher) on any average or better bin APU. So all in all I would expect an upgrade or even at least.
How so?
Both Raven Ridge and Picasso are Vega 14 and 12nm.
The only sku missing from that would be the Renoir Ryzen 9 w/12-13CU sku. You'd still have the 11CU one.
CPU 8C/16T max, GPU bis 16CU, 1 DIE