Unfortunately, Apple also showed pretty clearly that they were Intel's only customer that actually wanted to pay for high-end IGPs.Battery life is a major concern for the mobile consumer space. Advantages in node power usage could play a very large part here, especially as 80mm is a lot of space in N3 terms. Apple just showed high end IGPs can be a big selling point.
That was just a size comparison; I never expected Intel would put a memory interface on its own tile. And looking over that program again, it appears that MTL-M/P and ARL-P might share a common SoC tile, but there is probably an IOE-M for MTL-M and a slightly different IOE-P shared by MTL-P and ARL-P. I know those dies are tiny, but it still boggles my mind that that Intel would be willing to go through multiple tape outs, integrations, validations, etc. How can that possibly be cost effective? Also note that as of the final week of Q1 last year, B0 steppings of the MTL SoC-M/P and IOE-P were expected before the end of Q1'22.I think this is converging in the right direction. Something like 2 TB4 + 4 or 8 lanes of PCIe for the M segment, maybe? And then you could make it longer to add more for P? I could see that. Definitely wouldn't want DDR on there, even if it'd fit. Too many hops.
The one thing I can't figure out is what ADM is referring to... Any ideas on that? It doesn't seem to be the base tile, but that isn't referenced anywhere else either, as far as I can see.