Or they can dump LGA1200 and move to a larger socket that can feature a larger package.
my bet its willow cove or skylake
fwd to 4:10
Seems a bit fishy due to the spoofed email address and it's a new source. But it would make sense.
Sunny would be weird since even the mobile version would be released around/after Tigerlake is. And also, a Sunny core is 6.91 mm2 on 10 nm so a 10 core 14 nm die would start to get really big.
A bit disappointing to me to be to be sure. An $60-80 4C/8T 4.1Ghz with 4.5Ghz 1C turbo, would have made a decent little "budget gamer" base chip. Maybe even un-throne the Ryzen R5 3500 (or 3500, or 3500X, if those even ever show up in the USA).If you were hoping that Comet Lake Pentium would be 4C4T, doesn't look like it.
I dont't even know why they both to go to such R&D lengths / expenses, if they're just going to turn around and heavily gimp the chips before they make it to market. I mean, really Intel???.Comet Lake U Pentium and Celeron announced. Stingy Intel didn't even give the Pentium a turbo boost so the gap is so wide between it (2.4) and the i3 (which can boost to 3.7 on both cores and 4.1 on one). Talk about Trash bin chips.
I dont't even know why they both to go to such R&D lengths / expenses, if they're just going to turn around and heavily gimp the chips before they make it to market. I mean, really Intel???.
486SX anyone?I imagine it's exclusively chips that wouldn't pass the 10100U specs. But it does feel really stingy.
I dont't even know why they both to go to such R&D lengths / expenses, if they're just going to turn around and heavily gimp the chips before they make it to market. I mean, really Intel???.
That's a benefit to the Ring/Mesh that I hadn't really considered before, such as core/design modularity, thanks for bringing that to my attention.So making a new die isn't difficult as long as its based off a common design. You just cut cores/caches out. It's same with their Gen graphics. Every year they talk about modularity. Ring/Mesh has to do with this as well. Crossbar interconnections used in older chips like the Nehalem was not conducive to adding/deleting cores.
Not all that reliable honestly. They're OK.
Please remind me: the ix YzzzF series is an ix YzzzK with no iGPU?
Apparently, the September date has to do with when engineering samples were released into the wild.That list is more of a guess than anything else. TDP for K is 125 W and it obviously wasn't released in Sept 2019.