A 32c Zen 6c CCD would be approximately 170mm2. You really think this is achievable within the constraints of a business case on the most expensive process node available?
The math doesn't work IMO. I know that you simply rely of "stuff" as your logic (strange for a forum filled with tech heavy posters). Care to explain how you feel this is possible?
I did make a mistake on Zen 6c EPYC Dense though.
Current die is 16c on 3nm. A 25% die shrink gives you a 20 core CCD (if AMD wants to stay in the same ~85mm2 CCD die). So a 4 IOD part would be a 320c/640t.
How did the fit it into a die that they can manufacture profitably!

. The current 3nm CCD has 16 Zen 5c cores (stripped cache from full Zen 5 so it's smaller as well). Still, the N2 die shrink only gets you another 25% if you want to stay at the same die size for the CCD.
Ok. The shrink gets you 25% Care to explain how big the die would be in YOUR calculation?
Ahh. It's the "Stuff"! Now the math makes perfect sense to me Hulk. I left dy/dstuff out of my differential equation! Must be old age

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