Apple was 45,000 wafers for Q1/Q2/Q3... Q4 however is 20,000 wafers. (15,000 commited wafers to 6000 committed wafers); A14, A14X, Apple GPU.
AMD was 60,000 wafers for Q1/Q2/Q3... Q4 however is 90,000 wafers. (20,000 committed wafers to 30,000 committed wafers); Genesis(2.5D), Stones(3D), Arcturus(MI100), etc.
Common order capacity for Milan and other DDR4-3200 SoC that will not be named => 40,960 CCDs per customer quantity // ~60 day lead time to 2.5D/3D packaging facility and ~60 days lead time to SoC package in Singapore. Then, 60 days to HPE, Dell, etc.
Total capacity with Phase 1+Phase 2 for Q4 => 240,000 wafers per quarter. 240,000 - (90,000+20,000) => 130,000 wafers left over of overcapacity.
AMD+Apple = ~50% of wafers, rest is Hisilicon, Mediatek, and a few others.
We also know ARM was creating 5nm as well. Zeus N2 is both 7nm/5nm.