biostud
Lifer
- Feb 27, 2003
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I’m not here for the sake for meaningless arguing. Learn to read!
Intel would never give AMD an advantage on OpenFoam by leaving their CPUs with HT On and AMD with SMT Off.You have AMD's own marketing materials that have SMT off: https://www.amd.com/system/files/documents/amd-epyc-7Fx2-openfoam.pdf
This shows that in all applications tested, there are gains with lower core counts but not with higher ones: https://www.nas.nasa.gov/assets/nas/pdf/papers/NAS_Technical_Report_NAS-2015-05.pdf
You are talking about 6% gains in a specific scenario with most getting no gains or even lower with recommendations to disable SMT.
Intel would never give AMD an advantage on OpenFoam by leaving their CPUs with HT On and AMD with SMT Off.
Someone tells that woman that Intel 7 is Not the same as 7-nm process
It's worth noting that the actual silicon development falls under the Design Engineering Group.
This article is from Wednesday, but I don't think it was shared here yet. Anyway Intel has a hiring freeze in the Client Group right now. Which is claimed to be only for two weeks but probably will be longer.
The relevant point is that somewhere else I saw a suggestion that PC sales are slumping to the point where Intel might warn at some point. And their Q2 forecast was for a decrease in revenue as it is. Probally not an AMD thing but a macro thing.
Potential similar density, and similar performance. TSMC is calling it 7nm right?
1). TSMC hasn't used "nm" in their node names since 16nm/12nm
2). Intel had a 7hm process and renamed it to Intel 4
Anyone referring to Intel 7 as a "7nm process" is clearly in error.
I found this one the most interesting. The rumoured culprit of 10nm debacle seems to be gone and in its place is eCu, whatever that means. Overall seems to be very nice process advance versus "7"
It means enhanced copper.
Polly pitch was the real nm number.. i judge a node by density and polly pitchSemantics mostly, discussed and argued over and over again. Neither has any actual 7nm features in them and both can be called "7nm (marketing) class" processes.
What is important tho, is that Intel is back to being full node behind AMD.
They can fit 40 e-cores on this node.. ✅
can't wait for meteor lake 😁
Where did you find that? It's not a composite image?
Intel 4 has the highest density in the industry.. should be good for many years like 14nmIn theory, Intel must use EUV on M0 (and FEOL) only.
Other metal layer could be dealt with by SADP or single patterning.
This fact is very significant in yield / throughput.
Intel 4/3 & TSMC N3(N5?) combination might get back INTC's leadership.
I'm sure, IDM 2.0 is correct strategy.
Uhm, you are joking, right? Right?Intel 4 has the highest density in the industry.. should be good for many years like 14nm
He loves Intel. Asking him to remove the blinders is like trying to move a rock.Uhm, you are joking, right? Right?
Semantics mostly
He loves Intel. Asking him to remove the blinders is like trying to move a rock.