Lakefield uses the approach in Smartphone/Tablet chips where the DRAM is stacked on top of the CPU package.
Exactly, although I'd probably not use the word "stacked" since it's confusing here. Foveros is "stacked" semiconductor fabrication - a single package.
PoP RAM is a separate package just put on top of Foveros ("Package-on-Package").
I guess the word "glued" would be better but it also has some use already (and not very positive
).
Essentially, 3D packaging brings a lot of performance and power saving potential.
POP RAM basically saves some motherboard space.
But, I'm not sure if putting RAM in Foveros makes any sense (or even: is possible).
Either way, Intel doesn't make RAM, so they'd have to order something very specific for this design. PoP memory dies can be easily outsourced from the standard offer.
In order for them to offer a part with different memory configuration, they'll have to ask Intel for another chip that stacks different DRAM configuration.
I guess 8GB is the sweet spot for this segment anyway, so this is probably what OEMs ordered. It's not a high-performance part, so more RAM would be mostly wasted.
Windows is relatively frugal when it comes to hardware and MS constantly tries to slim it even further. Totally opposite to what's happening with Android.