At that point, it’s better to make a monolithic chip -- less silicon used, simpler design, and better yield.
But you need the full 8 channels for the Metals. This alleged 24 core monolithic part is quad channel.
At that point, it’s better to make a monolithic chip -- less silicon used, simpler design, and better yield.
How do you see Intel making a 24 core SPR server chip with 8 channel memory? You either use 4 XCC chiplets that are severely disabled, or you build a monolithic MCC chip as well. I believe MCC monolithic is a better option.Correct, some misguided folks here think that Intel will go to the trouble of making a Single 24C/48T Monolithic die
This is what I predict it will look with two 12 Core tiles and two dummy Silicon Tiles for suport
You build 8 channel MCC chip, and only use 4 when repurposing it as Xeon-W.But you need the full 8 channels for the Metals. This alleged 24 core monolithic part is quad channel.
Well in that case, I’m sure Intel will make a monolithic MCC chip for all the reasons I have given above. The 4 chiplet design only makes sense for high core count chips.A 24C/48T Sapphire Rapids CPU has been listed by YuuKi_AnS which is a good source
Well in that case, I’m sure Intel will make a monolithic MCC chip for all the reasons I have given above. The 4 chiplet design only makes sense for high core count chips.
Another Misguided Soul I see.
Look the 24C/48T HEDT parts will have 45 MiB L3 Cache and Quad Channel memory.. What do you think Intel is going to do with bottom of the Barrel Compute Tiles?
Please guide me, since I’m so misguided: How do you think Intel will make the 24/48 CPU that you pointed to earlier with 8 channel memory?Another Misguided Soul I see.
Look the 24C/48T HEDT parts will have 45 MiB L3 Cache and Quad Channel memory.. What do you think Intel is going to do with bottom of the Barrel Compute Tiles?
How do you see Intel making a 24 core SPR server chip with 8 channel memory? You either use 4 XCC chiplets that are severely disabled,
IceLake XCC is bigger, and the 10nm process has vastly improved since. ADL-S is 220 mm2, and they have no problems manufacturing that, both in terms of capacity and yield. SPR tile is less than double at 400mm2.Given that they keep delaying SPR, presumably because of yields, there's likely to be plenty of those. A theoretical monothlic 24 core SPR would be rather big for 10 nm, so you'd be cutting down anyway for the most part.
IceLake XCC is bigger
ADL-S is 220 mm2, and they have no problems manufacturing that, both in terms of capacity and yield.
Volume of that is probably very tiny considering any customer considering any XCC model is buying Epyc. I don't know how big a 24 SPR core part would be but I'll guess it'd be about the XCC die size.
Please guide me, since I’m so misguided: How do you think Intel will make the 24/48 CPU that you pointed to earlier with 8 channel memory?
Wasnt IceLake XCC like 40 cores? Is Golden Cove core that much bigger to make up for 18 less cores (assuming that 24 is full fat die)?
Additionally, is 10nm IceLake the exact same process as the 10nm Alder Lake/SPR?
AMD, since it has a separate IO die that contains all the memory channels and PCIe, doesn’t always have to use all 8 chiplets in every SKU. In non-stacked Milan parts, L3 can vary from 64MB to 256MB, which hints at fewer chiplets being used at times. For example the 32/64 7513 part has 128MB L3. This part can be made with 4 fully functional chiplets, or with 5 to 8 chiplets with varying numbers of core and L3 slices disabled. This gave AMD (starting with EPYC2) a lot of freedom, and it was a very frugal and brilliant design given their financial constraints.For Servers? The same way AMD has 8C/16T EPYC processors offers 8 Channel Memory, by enabling just two cores per CCD. In the Sapphire Rapids case it will be 6 Cores per tile.
For HEDT parts those 24C/48T parts will only have two active tiles so you can only expect Quad Channel
AMD does not have an answer to Intel at $99 as far as gaming is concerned.
How do you think they will make lower core count (say 28) chips? Definitely not by disabling half the cores on XCC chiplets; that’s too wasteful.
It would be much more cost efficient (total silicon used, and yield) to make smaller MCC monolithic chips at the lower end.
You know there is a monolithic 40 core IceLake Xeon already on 10nm, right? And according to the last earnings call, it’s in high volume manufacturing, selling 3M units last quarter. Of course, Intel doesn’t share what portion of that was XCC. At this point 10nm (Intel 10, Intel 7) is very healthy. The focus has now shifted to Intel 4/3 and Intel 20A/18A.What if they can't? What if the most cores they can yield on one tile is 15c, and they're struggling even to hit that target?
You know there is 40 core IceLake Xeon already on 10nm, right?
There are other reasons for a product to be delayed than yields...1). That's 10nm+
2). Different core
3). Different I/O layout
The proof is in the pudding. Sapphire Rapid still isn't out yet. They may have a lot of failed tiles, though.
I think Emerald Rapids will use the same system design as SPR, with updated core and uncore. There will be an additional row/col of cores in the chiplets to add up to 4 or 5 cores per chiplet, for a total of 16 to 20 additional cores per chip compared to SPR.I guess that MCC "24 Core Tile" was prepared for Birch Stream-AP LGA7529, DDR5-16ch, up-to-96cores and zen4-epyc competitor.
But probably now, it replaced by Emerald rapids-AP or Granite.
There are other reasons for a product to be delayed than yields...
I guess that MCC "24 Core Tile" was prepared for Birch Stream-AP LGA7529, DDR5-16ch, up-to-96cores and zen4-epyc competitor.
But probably now, it replaced by Emerald rapids-AP or Granite.