So if I'm reading this correctly, compared to Sandy Bridge, Ivy Bridge will have less heat rate (Watts) but more heat flux (W/m^2) right? This would seem to indicate that good contact (lapping) and high thermal conductivity (Cu cooler or at least the CPU contact area) for optimal cooling/overclocking. And/or water to increase heat transfer.
Yep.
Water or good air (NH-D14), but all cooling solutions will be challenged more with IB than they would be with SB.
And think about the nearly straight shrinks. A node shrink typically reduces power-usage ~20% on a normalized basis (20% less heat for same xtor count, clockspeed, die design) but it reduces the diesize by ~40%.
Watts goes down but not as fast as mm^2, so W/mm^2 goes up.
This is everyone's challenge in the industry. If you just keep shrinking your chips then you reach a point where the node shrink enabled reduction in power-consumption alone is not enough to keep temperatures in check because the heat dissipation requirement is too high.
