From what I have seen of leaked ES results they require quite a bit less voltage to hit higher clocks but they also get hotter as the cores are more tightly packed together due to the smaller manufacturing process. Also nobody has data on how well the 3d transistors cope with higher than stock voltage and what the degradation is like.
TL : DR
All info availible atm is to be taken with a grain of salt.
I also seen some initial reports of this chip ES version hitting close to 5 but gets very hot. But considering it's ES hard to say what the final product will be like, however, I have a feeling for people expecting 5+ overclocks, you need water.
The heat will be more concentrated but with proper cooling it should actually make the chips run cooler overall. There will be less heat, it will just be focused on a smaller space. Perhaps Intel will engineer a special heat spreader.Think about it, you have more transistors in a smaller space which means the cores will need to have more cooling.
The heat will be more concentrated but with proper cooling it should actually make the chips run cooler overall. There will be less heat, it will just be focused on a smaller space. Perhaps Intel will engineer a special heat spreader.
Anand said his sample ran cooler with lower power consumption.Why will there be less heat????
More transistors = more heat
Smaller process = more heat generated per mm2
Ok maybe intels 3d transistors will be lower leakage than their existing ones but that is in no way a given.
This is pretty much backed up from an ES test I read showing the chip stable at 4.8ghz @ 1.35v while hitting 90c+
Anand said his sample ran cooler with lower power consumption.
When they use a new smaller process there tends to be less heat and less power. I don't think the leak you read is accurate. I don't see why overclocked it would all of a sudden run hotter than Sandy Bridge.
I just don't know what they're going to do soon. My heatsink extends right to the side of my case. All they could do is make it wider, but even then they're going to hit the back of the case and other components soon.All you have to do is look at heatsinks nowadays to see that cooling needs continue to increase. When I built my Athlon XP system in 2001...I used one of the best coolers on the market, an all-copper block of a heatsink from Thermalright...it was massive, and it's about 1/2 the size of the CoolerMaster TX-3 I have on my current chip...and that's certainly not one of the bigger HSFs out there.
I'm just saying that it doesn't make sense. It's not logical. The only concrete info we have is from Anand's preview.why ask about overclocking capabilities then refused info given by people who posted some results?weird.