Discussion AMD's Soundwave ARM APU: The Beginning of Transformation !!!

[DZero]

MS is about to implode and don't do nothing to avoid that.

 

[madtronik]

All in all, you remind me of someone from beyond3d forums (was it juanrga?).
Never listening to facts presented by others, always spinning your own tale, no matter how little sense it makes.

Are you talking about that guy that said that AMD would be destroyed by ARM from below and Intel from above?

 

[NTMBK]

!!!!!!!!

Internet Strongman reference sighted! Batton down the hatches! Sound the alarms! We are not prepared for an incursion by Internet Strongman juangra!

Just wait until you find his alternative physics textbooks, ooh boy

 

[igor_kavinski]

Just wait until you find his alternative physics textbooks, ooh boy

Made in Russia?

 

[NTMBK]

Made in Russia?

Because Juan is such a famous, quintessentially Russian name

 

[Schmide]

This is the best of juanrga tech, he's from Spain btw.

https://www.juanrga.com/2018/10/basic-remarks-on-parallel-computing.html

Not the best intuition on computing, but good at presenting his arguments.

 

[DrMrLordX]

Just wait until you find his alternative physics textbooks, ooh boy

I don't think I can handle that.

 

[marees]

Is this AMD Soundwave

https://twitter.com/x/status/1977440121143361752

 

[poke01]

Is this AMD Soundwave

https://twitter.com/x/status/1977440121143361752

Why is it so big

 

[marees]

Is this AMD Soundwave

https://twitter.com/x/status/1977440121143361752

Google AI overview scolds me (gaslights me?) & says no such socket as FF5 exists

• Mobile socket names: AMD has used many mobile BGA sockets over the years. Recent BGA platforms include:
  • FP5: Used by early mobile Ryzen 7 and other processors in the Ryzen 7000 series, like the Ryzen 7 2700U.
  • FL1: Used by high-performance mobile parts, including the Ryzen 9 7945HX3D.
  • FP7/FP7r2: Used for Ryzen 7000 and earlier series mobile processors.
  • Strix Point/Strix Halo: The latest series of mobile processors use BGA sockets and are often cited by their codenames.

 

[marees]

Google AI overview scolds me (gaslights me?) & says no such socket as FF5 exists

• Mobile socket names:AMD has used many mobile BGA sockets over the years. Recent BGA platforms include:
  • FP5: Used by early mobile Ryzen 7 and other processors in the Ryzen 7000 series, like the Ryzen 7 2700U.
  • FL1: Used by high-performance mobile parts, including the Ryzen 9 7945HX3D.
  • FP7/FP7r2: Used for Ryzen 7000 and earlier series mobile processors.
  • Strix Point/Strix Halo: The latest series of mobile processors use BGA sockets and are often cited by their codenames.

Never mind

Leaks Suggest AMD AM5 Future Support for Ryzen 9000G "Gorgon Point" & EPYC 4005 "Grado" CPUs

PC hardware watchers continue to pore over official AMD repositories and adjacent databases, in the hopes of finding unannounced next-gen technologies. Olrak29 and InstLatX64 have presented their latest Team Red-related findings; apparently reaching across futuristic desktop, mobile, and...

www.techpowerup.com

 

[marees]

Never mind

Leaks Suggest AMD AM5 Future Support for Ryzen 9000G "Gorgon Point" & EPYC 4005 "Grado" CPUs

PC hardware watchers continue to pore over official AMD repositories and adjacent databases, in the hopes of finding unannounced next-gen technologies. Olrak29 and InstLatX64 have presented their latest Team Red-related findings; apparently reaching across futuristic desktop, mobile, and...

www.techpowerup.com

More confirmation from Google search

Using the never-before-seen FF5 socket, AMD is also allegedly working on a new lineup of mobile offerings dubbed Soundwave. The rumor mill positions this as a low-power, Arm-based device from AMD, employing Radeon graphics. This might be AMD's response to Nvidia's rumored N1X SoCs for the WoA (Windows on Arm) ecosystem. If these SoCs are anywhere near their launch, we'll probably hear more about them at Computex.

AMD is reportedly readying Ryzen 9000G (Gorgon Point) and EPYC 4005 (Grado) CPUs for AM5

Along with several new Ryzen mobile offerings.

www.tomshardware.com

 

[adroc_thurston]

Using the never-before-seen FF5 socket

yeah same swimlane as Van Gogh (that one was FF3 iirc).

 

[Tigerick]

I have asked Gemini to overlap FF5 and STX FP8: Soundwave total package is about 86.4% of STX: most likely due to better power efficiency (STX has to draw up to 54W to support turbo boost). And please check the table I created in the frontpage. As I said, Soundwave is the successor of STX to compete with Apple M5 and Qualcomm's X2. So please don't believe in non-sense specs of 2P+4e and 4 RDNA3.5 CU with improved ML from MLID...

 

[NTMBK]

View attachment 131952
I have asked Gemini to overlap FF5 and STX FP8: Soundwave total package is about 86.4% of STX: most likely due to better power efficiency (STX has to draw up to 54W to support turbo boost). And please check the table I created in the frontpage. As I said, Soundwave is the successor of STX to compete with Apple M5 and Qualcomm's X2. So please don't believe in non-sense specs of 2P+4e and 4 RDNA3.5 CU with improved ML from MLID...

The socket size is almost entirely down to pin count, which is driven by how much I/O is on the chip. This probably just means that FF5 has fewer PCIe lanes.

 

[Tigerick]

If we scale directly from the package size, I could estimate the die size of SoC: 200mm2 @ N3P. Sound about right.

FYI, Dimensity 9500 with 1+3+4 8-core C1 series (same as Soundwave), 12-core GPU, 100TOPS NPU and 5G Modem has about 140mm2 @ N3P. Hoho, think guys! You still think AMD will use 2+4 CPU and 4CU GPU?

ARM SoC	Node	Die Size	TDP	Memory Interface		CPU	GPU	NPU	5G Modem
Dimensity 9500	N3P	140 mm2	~14W	64-bit LPDDR5x		1+3+4 8-core C1	12-core G1-Ultra	100 TOPS	Integrated
Soundwave	N3P	~ 200 mm2	~28W	128-bit LPDDR5x		C1 12-core ?	RDNA4.5 12CU?	80-110 TOPS	Integrated ?
X2 Elite Extreme	N3P	287 mm2	~50W	192-bit LPDDR5x		12+6 18-core Oryon v3	X2-90 24CU	80 TOPS	Integrated

 

[marees]

Charlie post/leak about the "Socket that QCOM lost" (AMD custom Arm APU ordered by MS

Any link — for AMD Arm apu ordered by MS

 

[Tigerick]

ARM SoC with 5G Modem: Centrino 5G Moment

Thanks @marees for the like of old thread below:



A LOT attention being paid by senior management? Of course, this is first ARM SoC from AMD to compete with next gen mainstream computers. Not low power 2+4 CPU with 4CU GPU, Jesus....

To win Surface from Qualcomm? How? Qualcomm has 5G modem which has started integrated with SoC like X2-EE?
Answer: To license 5G modem IP from Samsung and integrate with Soundwave.

Why timing is extra important for Soundwave?
Answer: Cause AMD, NV, Mediatek, Samsung and Qualcomm are all going on-stage to unveil their ARM solutions togethers under Windows on ARM 12 announcement.



When AMD signed a deal with Samsung supplying Radeon IP to Exynos series, what do AMD gets in return beside new competitor in PC market? Well, AMD will get 5G Modem IP from Samsung. Thanks to the table above, I think AMD will integrate 5G modem inside Soundwave 200mm2 SoC just like X2 series.

Yes, 5G modem integration is next frontier of mobile computing. Qualcomm, Mediatek and Samsung have been doing it for their phone SoC. It is times for mobile computing. That's why NV and AMD are partnering with Mediatek and Samsung to offer total solution for PC market. If you are old enough to remember Centrino with WiMax solution, here comes Centrino 5G moment. We are finally getting real full day battery life with Internet connectivity anywhere. Please checkout HP Go package, I think this is the feature Apple is working with their C1 modem too.

X2-Elite with 128-bit memory bus is way too power hungry for Surface Pro. So, what Soundwave features will standout compared to upcoming Qualcomm X2 SoC? Otherwise, how could Microsoft switch to AMD's Soundwave?