Discussion AMD's Soundwave ARM APU: The Beginning of Transformation !!!

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madtronik

Junior Member
Jul 22, 2019
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:laughing:

All in all, you remind me of someone from beyond3d forums (was it juanrga?).
Never listening to facts presented by others, always spinning your own tale, no matter how little sense it makes.
Are you talking about that guy that said that AMD would be destroyed by ARM from below and Intel from above?
 
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marees

Golden Member
Apr 28, 2024
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Google AI overview scolds me (gaslights me?) & says no such socket as FF5 exists


  • Mobile socket names: AMD has used many mobile BGA sockets over the years. Recent BGA platforms include:
    • FP5: Used by early mobile Ryzen 7 and other processors in the Ryzen 7000 series, like the Ryzen 7 2700U.
    • FL1: Used by high-performance mobile parts, including the Ryzen 9 7945HX3D.
    • FP7/FP7r2: Used for Ryzen 7000 and earlier series mobile processors.
    • Strix Point/Strix Halo: The latest series of mobile processors use BGA sockets and are often cited by their codenames.
 

marees

Golden Member
Apr 28, 2024
1,781
2,398
96
Google AI overview scolds me (gaslights me?) & says no such socket as FF5 exists


  • Mobile socket names:AMD has used many mobile BGA sockets over the years. Recent BGA platforms include:
    • FP5: Used by early mobile Ryzen 7 and other processors in the Ryzen 7000 series, like the Ryzen 7 2700U.
    • FL1: Used by high-performance mobile parts, including the Ryzen 9 7945HX3D.
    • FP7/FP7r2: Used for Ryzen 7000 and earlier series mobile processors.
    • Strix Point/Strix Halo: The latest series of mobile processors use BGA sockets and are often cited by their codenames.
Never mind

 

marees

Golden Member
Apr 28, 2024
1,781
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Never mind

More confirmation from Google search

Using the never-before-seen FF5 socket, AMD is also allegedly working on a new lineup of mobile offerings dubbed Soundwave. The rumor mill positions this as a low-power, Arm-based device from AMD, employing Radeon graphics. This might be AMD's response to Nvidia's rumored N1X SoCs for the WoA (Windows on Arm) ecosystem. If these SoCs are anywhere near their launch, we'll probably hear more about them at Computex.

 
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Tigerick

Senior member
Apr 1, 2022
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AMD-FF5.png
I have asked Gemini to overlap FF5 and STX FP8: Soundwave total package is about 86.4% of STX: most likely due to better power efficiency (STX has to draw up to 54W to support turbo boost). And please check the table I created in the frontpage. As I said, Soundwave is the successor of STX to compete with Apple M5 and Qualcomm's X2. So please don't believe in non-sense specs of 2P+4e and 4 RDNA3.5 CU with improved ML from MLID...
 
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NTMBK

Lifer
Nov 14, 2011
10,448
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View attachment 131952
I have asked Gemini to overlap FF5 and STX FP8: Soundwave total package is about 86.4% of STX: most likely due to better power efficiency (STX has to draw up to 54W to support turbo boost). And please check the table I created in the frontpage. As I said, Soundwave is the successor of STX to compete with Apple M5 and Qualcomm's X2. So please don't believe in non-sense specs of 2P+4e and 4 RDNA3.5 CU with improved ML from MLID...
The socket size is almost entirely down to pin count, which is driven by how much I/O is on the chip. This probably just means that FF5 has fewer PCIe lanes.
 

Tigerick

Senior member
Apr 1, 2022
853
802
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If we scale directly from the package size, I could estimate the die size of SoC: 200mm2 @ N3P. Sound about right.

FYI, Dimensity 9500 with 1+3+4 8-core C1 series (same as Soundwave), 12-core GPU, 100TOPS NPU and 5G Modem has about 140mm2 @ N3P. Hoho, think guys! You still think AMD will use 2+4 CPU and 4CU GPU? :cool:

ARM SoCDie SizeMemory InterfaceCPUGPUNPU5G Modem
Dimensity 9500140 mm264-bit LPDDR5x1+3+4 8-core C112-core G1-Ultra100 TOPSIntegrated
Soundwave~ 200 mm2128-bit LPDDR5xC1RDNA4.5 ?80-110 TOPSExternal ?
X2 Elite Extreme287 mm2192-bit LPDDR5x12+6 18-core Oryon v3X2-90 24CU80 TOPSIntegrated
 
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