It's a
SERDES and you're able to go some distance between the two. That's how we've always connected the two. And that's a low cost interface, if you will. It is a high bandwidth interface. But that had low-power states that could only take it so far. And you had retraining and latency implications every time the chip went down and came back up and so on. So for an always-on kind of a desktop kind of machine, that seemed like the best interconnect to connect that as we try to build this into an APU. The first thing we had to do was to change the interconnect between the two dies. And so the CCD that you see here, the core die that you see here, has a different item. That's the first change.
That's a sea of wires. We use fan out, we're for level fan out in order to connect the two dies. So you get the lower latency, the lower power, it's stateless. So we're able to just connect the data fabric through that connect interface into the CCD. So the first big change between a
Granite [Ridge] or a 9950X3D and this Strix Halo is the die-to-die interconnect. Low-power, same high bandwidth, 32 bytes per cycle in both directions, lower latency. So everything - and almost instant on-and-off stateless - because it's just a sea of wires going across. So it's a little [bit of a tradeoff] of course, the fabrication technology is more expensive than the one over there [points to a 9950X3D], but it meets the needs of the customer and the fact that it has to be a low power that can actually connect.