What was the pic with the curved copper areas?
It was a visual artifact of the interposer and thermal compound.
What was the pic with the curved copper areas?
PossibleMaddie
Are you saying Fiji will be faster than the 295x2? What?
The worst thing we can do is set the bar high. Actually, the rumors of a slow Fiji can help it have a huge buzz if it launches faster than the 980ti and TitanX.
I think the 980ti is in short supply and surely the people who were gonna wait, they will wait.
It was a visual artifact of the interposer and thermal compound.
@maddie, where does the 10% density increase come from?
It's not.Could be, but I really don't think so.
Looks different to me.
http://forums.anandtech.com/showpost.php?p=37445180&postcount=1751
@maddie, where does the 10% density increase come from?
It's not.
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Look at the bottom left corner of the interposer, you can see that it extends to a square shape and the circle where the thermal paste touches is shinier. Also, you can see that small rectangle that's part of the interposer, half in the shiny part, half out. In the good die shot, you can see that square in the bottom right.
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AMD is using newly developed high density libraries that are supposed to increase the design density ~10%.
AMD is using newly developed high density libraries that are supposed to increase the design density ~10%.
and glofo 28nm SHP supposedly is more dense. So is this double improvement in density or do I fail?
When I rotate the bottom pic to the same orientation, it still looks different to me.
Oh well, it's not really important.
Let's hear about the cards.
So better than 295x2 is possible. 14nm will be ridiculous.
Shader portion = 292 mm2 [2/3 area]
I doubt we will get 10% density improvement for gpu logic using hdl libraries.
As i remember the hdl competences is comming from the gpu side so its knowledge implemented today. Secondly i would asume gpu logic is more repeated so to speak so the benefits is less. It might be wrong whats your take on it?
I'm not sure how much better performance we'll get at the top end with 14nm, at least at the start. It will depend on scaling.
It's taken years for AMD to attempt a 600+mm^2 die. Given the troubles that 14nm has had, it might be awhile before we see a die anywhere near size. I think we might see something closer to the 300-350mm^2 die that Tahiti introduced at. It should be faster and a lot more efficient, but maybe the massive increase we'd hope for.
