It's a shame too as there is a huge opportunity given the Intel chip shortage. Lots of companies want standard enterprise mobile options but AMD and major manufacturers just haven't focused on AMD mobile devices enough for them to be well optimized solutions in easily customizable ordering configurations deployable at scale.
I fully agree that it's been a nagging lost opportunity to further unseat Intel with their Zen line, but I wonder if it's all back to the capacity limitations of sharing what TSMC has to offer when they can get it. If that's indeed the case and they can only get XX,XXX wafers per quarter or whatever, then their most profitable choice is to use as many as possible for things like the 8C Zen2 chiplets, as the ASP is much higher. It's certainly true that if they could offer greater numbers of mobile SKUs and in a more timely manner (eg; the lag to getting 7nm Zen2 mobile), then I feel their success would be greater still.
I feel sincerely that Intel isn't the enemy of AMD, but rather practical limits when you're forced to share a Fab with a ton of other major tech companies. In that event, capitalism and reality collide to say : he who pays the most gets the capacity (what there is anyway). And if you have a flagship ARM product that is ~545!! NDPW on 7nm, and each has an ASP of $85+, that blows the doors off a 7nm 8C Zen chiplet, of which are only 96 per wafer! $12,000-$12,500 per wafer is currently the rate, but TSMC is not a democracy, they'll gladly take a better offer from your competition, as they hold all the cards (literally, lol).
For AMD to reach the next step at being a premiere global semiconductor superpower, they need to regain their fabs. This is why Intel's basically inarguably inferior current products are selling completely out. It's not that the world is chock full of idiots that don't know any better (well, some of those lol), but rather the big OEMs need to ship laptops, desktops, nucs, thin clients, servers, etc, and Intel has the volume and product stack to meet that. Chipsets, IGP, SATA, USB, Thunderbolt, NIC, SSD, WiFi, they can provide stacks of items that make an OEMs workflow relatively smooth.