LightningZ71
Golden Member
- Mar 10, 2017
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There is no reason that the existing AM4 socket can not support a Ryzen package with two dies onboard at 7nm if they keep the die with its current layout of 2 X 4core CCX. That die gets TINY. Two of them on a package can be connected to each other just like TR1 was. The extra I/O lanes just go unused. The DDR channels can either be split between the two die, or they can both go to one die and the other can piggyback off of the primary die. With improvements made to the uncore clocks and the IF connections between the die, the net effect can be substantially reduced.
Even if they basically die shrink the existing Zen+ die to 7nm, and make minor internal tweaks, putting 6-8 of them on an epyc package is still going to be a significant undertaking. It will require more layers on the MCM for signal routing (more expense, greater chance for failure, etc) and, to get to a 2P solution like they currently have, it will require an expensive, and custom, glue logic chip. Right now, AMD needs to sell on value first, and both of those things don't help that.
The shrink to 7nm allows them to expand on chip resources without making significant changes to their existing packages and sockets. They have pledged to maintain AM4 and the Epyc/TR socket for a couple more years. 7nm won't change that. I expect 7nm to give us floorplan changes for the die, and only minor revisions to the packages. To get where AMD wants to be, though, they may be forced to do multiple die. I'm expecting that they will maintain the 4 core CCX to keep direct access between the cores to as minimal a delay as possible. I suspect that they will add additional CCX units as needed. It would not shock me to see a consumer 3 X 4 core CCX design get released through GloFo (Ryzen 3X00 from 200 to 700, focus on clocks) and a high end 4 X 4 core CCX design get used for Epyc, TR, and a HEDT AM4 solution ( Ryzen 3800) that focus on low energy and efficiency. Additional CCX units are not a major technological hurdle for the zen architecture as they all connect over the IF. If they make improvements to the IF uncore, they can mitigate the impact of additional inter CCX traffic.
Even if they basically die shrink the existing Zen+ die to 7nm, and make minor internal tweaks, putting 6-8 of them on an epyc package is still going to be a significant undertaking. It will require more layers on the MCM for signal routing (more expense, greater chance for failure, etc) and, to get to a 2P solution like they currently have, it will require an expensive, and custom, glue logic chip. Right now, AMD needs to sell on value first, and both of those things don't help that.
The shrink to 7nm allows them to expand on chip resources without making significant changes to their existing packages and sockets. They have pledged to maintain AM4 and the Epyc/TR socket for a couple more years. 7nm won't change that. I expect 7nm to give us floorplan changes for the die, and only minor revisions to the packages. To get where AMD wants to be, though, they may be forced to do multiple die. I'm expecting that they will maintain the 4 core CCX to keep direct access between the cores to as minimal a delay as possible. I suspect that they will add additional CCX units as needed. It would not shock me to see a consumer 3 X 4 core CCX design get released through GloFo (Ryzen 3X00 from 200 to 700, focus on clocks) and a high end 4 X 4 core CCX design get used for Epyc, TR, and a HEDT AM4 solution ( Ryzen 3800) that focus on low energy and efficiency. Additional CCX units are not a major technological hurdle for the zen architecture as they all connect over the IF. If they make improvements to the IF uncore, they can mitigate the impact of additional inter CCX traffic.