I gave up because sandy on 22nm *IS* Ivy bridge. There are no versions of sandy bridge on a 22nm process not based on the Ivy bridge code name, because Ivy is the overall codename for 22nm. It encompasses various derivative (ivy-EX, ivy-DT, ivy-EP, etc) codenames, but no superior (relevant) codenames. Thus the concept of a 22nm sandy derivative thats not an ivy is...confusing. At best.
IDC (et al), whats your take on a s2011 hex layout looking something like this? I don't know how big the QPI buses are, but...thoughts? Could the empty die space on sandy quads be to have the memory-connection be the right length for the high-volume parts?
Assuming no significant performance impacts are to come from the choice of layout (a false assumption, but let's see where it takes us), the next dominant factor in determining layout will be the question of "how many die per wafer can we get?".
Using Michael Hackerott's
wafer-layout simulator with some basic expectations for industry norms (3mm WEE, etc) we arrive at a value of
297 Sandy Bridge chips per 300mm wafer if the die is 20.5mm x 9.9mm (203 mm2) and the usual host of scribe seals and reticle spacing steps, etc.
If we lop off the GPU logic area (~4.7mm wide) that leaves us with a quad-core chip that is 15.8mm x 9.9mm (157 mm2). This layout has potential to generate 380 quad-chips per wafer.
If we add two cores to this, elongating the chip just as the GPU does, then we end up with a hex-core chip that is
22.1mm x 9.9mm (219 mm2) for a layout with the potential of generating
269 hex-core chips.
That doesn't accommodate a second memory controller nor the requisite QPI logic for multi-socket support.
If we use the dead space to double the IMC we end up with a chip that is
24.4mm x 9.9mm (242 mm2) with a floorplan that allows for 20mm^2 die area for the QPI and generates
243 chips per wafer.
Now lets look at the alternative, cutting Sandy down to a 3-core wide chip and then mirroring it so it becomes more of a square than a rectangle.
Such a layout would result in a chip
12.7mm x 19.8mm (252 mm2) with a floorplan that accommodates 25 mm2 die area for QPI and generates
231 chips per wafer.
And last but not least let's consider the 8-core and 10-core possibilities.
Extending the hex-core layou above to 8-cores nets a chip 15.8mm x 19.8mm (313 mm2) with 177 chips per wafer.
Extending to 10-cores nets a chip 19.0mm x 19.8mm (376 mm2) with 151 chips per wafer.
And if they went all-out for a 12-core chip it would be 24.4mm x 19.8mm (483 mm2) for 115 chips per wafer with 4 memory controllers and a whopping 40 mm2 of die area for the engineers to place QPI plus whatever else they'd want on such a mammoth chip.
You'll note I took some liberties with moving the IMC controller to the right a bit in these photoshopped diemaps to minimize the overhang. My justification for doing this is that the logic region to the right of Sandy in these diemaps includes a fair amount of GPU related logic which itself would be removed along with the GPU logic block, giving layout room for optimizing the location of the memory controllers anyways.
(and for those interested, a 2C full 12EU GPU chip would see about 430 chips per wafer)