The lack of solder has really cooled my jets regarding this release. I was prone to doing something impulsive on release day. I said "was". Now I will simply have to see how these chips perform thermally under a high OC. I'm having thoughts of an 8 core skylake@4.6 hitting upper 70's low 80's while just gaming under custom water. That simply won't do it for me. I don't like the idea of de-lidding. Intel has a performance tuning protection plan, not a disassemble and insert your own goo protection plan. I'd consider bare die cooling, but I think bare die cooling can also lead to bare die cracking. Oh wells. Guess they pasted these fancy new chips. Too bad.