You're killing me here. P is a package, U is a platform prefix, neither are dies. Nobody at Intel feels strongly enough about Rocket Lake to delay the release of their highest volume client platform.In practice it's more likely to be the same time. This year is probably going to be just K. Some of it is probably embarrassment over Rocket Lake.
Also the P die almost has to be way bigger than the U one.
ADL Platform | ADL Die | ADL Package |
---|---|---|
M5 | 2+8+2 LP | M (BGA 1781) |
U9 | 2+8+2 LP | M (BGA 1781) |
U15 | 2+8+2 LP | P (BGA 1744) |
U28 | 6+8+2 LP | P (BGA 1744) |
H45 | 6+8+2 LP | P (BGA 1744) |
H55 | 8+8+1 HP | S BGA (BGA ????) |
S35 | 6+0+1 HP or 8+8+1 HP | S (LGA 1700) |
S65 | 6+0+1 HP or 8+8+1 HP | S (LGA 1700) |
S80 | 6+0+1 HP or 8+8+1 HP | S (LGA 1700) |
S125 | 8+8+1 HP | S (LGA 1700) |
We can be pretty certain that the 6+8+2 LP die is bigger than the 2+8+2 LP die, and the 8+8+1 HP die is larger than the 6+0+1 HP die.
We've seen a leaked slide that showed ADL-S 8+8+1 as being on the production dashboard for WW35'21 start of volume production, indicating a possible Q4'21 launch, and ADL-S 6+0+1 as WW41'21 start of volume production for a possible Q1'22 launch.
8 years of historical data tell us that Intel is almost certainly shooting for a Q3'21 launch for 2+8+2 LP products, and the schedule for the past 4 years would indicate that 6+8+2 products will follow in Q2'22.