@Hulk I personally concluded that die size is the reason for not using Willow Cove. 40-45mm2 for 4 cores mean 90mm2 on the 14nm process, and 180mm2 with just 8 cores. If you add in the System Agent, the Memory/PCI Express PHY, and the iGPU, its going to end up at 250mm2 or larger. And they are having problems with supply.
There are likely lower level details that changed on the 14nm backport which might lead to low single digit percentage performance loss.
Even on desktops Rocketlake uses so much power that its going to rival 200-250W of Cometlake again.
Might be a combination of all three, clock speeds falling slightly short, yield issues, and not enough capacity on 10nm.
@jpiniero They had Kabylake-X, which made little sense. The 11370H might also be based on the Tigerlake-H die even though its 4 cores just like TGL-U.
@Exist50 It's interesting how much the two teams diverge in architectural details. I'm excited to see Jasper Lake.
Unlike Elkhart Lake, Jasper Lake is an SoC. Elkhart Lake has 3x 2.5GbE and other I/O features that's going to be useful for IoT and may have needed a separate PCH. Jasper Lake won't need the 2.5Gbe nor the extra IO, and it'll integrate the WiFi MAC again. SoC also lowers system level power which is a great thing for laptops.