All Cometlake dies.
-U: 2/4/6
-H: 4/6/8
-S: 6/8/10
Totally being pedantic here, but the total number of new dies for Comet Lake will only be between 2 and 4.
For platforms you have the following:
CML-Y 2/4C
CML-U v1 (LP3) 2/4/6C
CML-S 2/4/6/8/10C
CML-H 8/10C (possibly lower core count as well)
CML-U v2 (LP4x) 2/4/6C
Intel decided to go with the Comet Lake Y name in their public announcements of AML-Y 4+2, which is actually built using the WHL-U 4+2 V0 die in conjunction with the SPT-LP PCH.
CML-U v1 launched as 6 SKUs, only one of which requires the new A0 6+2 die. The others can all be made using the WHL-U 4+2 V0 die, however they should all be paired with the 400 Series CMP-LP (a.k.a. ICP-LP) PCH. In fact, it appears that the Core i7-10510U, the highest clocked 4-core model, can only be built from the older V0 die. Obviously the V0 die does not have LPDDR4X support, and if A0 does then it has yet to be enabled for any available SKU.
The S and H platforms generally share dies. CML-S will clearly require a new 10+2 die, and Intel has indicated that the majority of the product stack will be built from 6+2 and 10+2 dies in LGA1200 packages. The cynical side of me thinks the original CFL-H/S 6+2 U0 die may make another appearance here, but being stepping 10 it is due for a refresh for security patches if nothing else. The PCH is a separate package for the H/S platforms, and H CPUs are sticking with BGA1440, so all of the lower core count CML-H SKUs can just be renamed Coffee Lake / Coffee Lake Refresh chips.
CML-U v2 should finally bring LPDDR4x support, and the A0 die may well be capable of that already, especially seeing as how it carries the entirely new 166 model number. However, Intel may do a second stepping of 6+2 or a proper CML-U 4+2 v2 die to replace the current WHL-U 4+2 die.
edit: clarify CML-H/S packaging situation.