You want cost-optimized node? That's Samsung or TSMC territory. You want low leakage or RF stuff? That's GloFo's territory.
Intel's bread and butter were always bleeding edge nodes and they've lost their advantage.
These people are somewhere in the upper management.
Its only bread and butter so long you have the portfolio to fund it. 4 years ago that was easy to see. Today. Not so much.
The 10nm server was actually such a product. And granted thats where it hurts.
There are bound to be development errors. Euv adaption to late what not. But its easy to pinpoint in hindsight.
I dont know. But if you buy 10 new big lithography machines and use several B to play with it just to learn you better have a good and some sort of specific business case imo.
And whats that case today?