So they got it wrong. While Meteorlake does use second generation Foveros, Omni is farther away.
Anandtech article also says the same thing, with Omni being 3rd generation:
https://www.anandtech.com/show/1682...-3nm-20a-18a-packaging-foundry-emib-foveros/4
On a side note, I don't know why articles like from Semianalysis makes a big deal about package size and mobility designs, especially for laptops.
They already make really compact designs from OneNetbook and such. Since Haswell, the chipset has been part of the package. Cutting that in half won't change things too much. So you have the board that's much much larger, but reducing the size of the chip that's less than 5% of the area will change things? Really?
Maybe in Tablet designs, but they got other things to worry about like power use and Jasper Lake with not so small package also has Tablet designs. This focus on package size is like looking at trees instead of the forest.
The bigger impact to overall design size is TDP, because heatsinks are quite large, and efficiency, so the battery doesn't have to be humongous.
"Let's cut the package size in half, that's going to be awesome in making tiny laptops!"
"Uhh, but what about the 125W TDP? Surely that factors in device size a tad?"