- Feb 12, 2013
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The GlobalFoundries 22FDX family of process technologies consists of four options:
22FD-ulp: Designed for inexpensive system-on-chips used for mobile applications. The process uses body-biasing, and delivers greater than 70 per cent power reduction compared to 0.9V 28nm HKMG. Moreover, select chips made using 22FD-ulp will be able to operate at 0.4V.
22FD-uhp: Designed for networking applications with analog integration. The manufacturing tech offers forward body-bias, application optimized metal stacks, and support for 0.95V overdrive.
22FD-ull: The process tech is aimed at Internet-of-Things devices and features leakage of as low as 1pa/um. The manufacturing tech sports flexible body-biasing and other capabilities designed to reduce power consumption.
22FD-rfa: The process tech developed specifically for radio frequency and analog applications. The technology will be used to make high-volume RF applications such as LTE-A cellular transceivers, high order MIMO WiFi combo chips, and millimeter wave radar.
GlobalFoundries 22FDX process technologies are expected to be used by multiple designers of chips and are supported by various IP providers. Among supporters of the manufacturing processes are ARM, Imagination Technologies, Freescale, IBS, STMicroelectronics, VeriSilicon and other. Design starter kits and early versions of process design kits (PDKs) are available now with risk production starting in the second half of 2016. Mass production of 22FDX chips will start in the second half of 2017.
source http://www.kitguru.net/components/a...-introduces-22nm-fd-soi-process-technologies/
@IDC what do you think?
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