"The good news is TSMC believes it can offer the full advantages of a new process node with a 10nm FinFET process, including a doubling in the density of logic gates relative to the 16nm node. Designers could start early work in the 10nm process before the end of 2015, Sun said."
http://seekingalpha.com/article/196...semiconductor-have-very-different-definitions
16FF entered risk production in November 2013. I wouldn't expect 10nm to be less than 2 years later. And:
"10nm FinFET technology is under development [since 2013] to keep TSMCs
technology leadership position in the industry. It is expected to be
ready for production by end of 2015."
Source: http://www.tsmc.com/download/ir/annualReports/2013/english/annual2013e.pdf
Doesn't say what kind of production (risk, mass, ..., )?
Risk production. Mass production earliest in 2016 (thread title).
Those are not the only types of production to chose from. Could be e.g. risk production in 2015Q1, early prototype production for customers in 2015Q4, and mass production in 2016.
A projected full fab utilisation for 5+ years equals a lot of low risk cash. And ~360k wafer starts per month on 28nm alone is close to what Intel produces in total. Just as a reminder, those numbers carry a lot more value than your analysis.The prospects for TSMCs 20nm and below is also relatively megre. 28nm is expected to stay strong through 2020.
![]()
And it also explains what we see, with big customers already annoucing that they have no interest in 20nm or below due to economic reasons.
Critical analysis of these slides: http://electroiq.com/blog/2014/01/intel-vs-tsmc-an-update/Further cost and size compares between TSMC and Intel for 2015 and 2016.
![]()
![]()
I have no doubt that the Jefferies estimate is overly optimistic, however the author makes a lot of errors in his analysis.A projected full fab utilisation for 5+ years equals a lot of low risk cash. And ~360k wafer starts per month on 28nm alone is close to what Intel produces in total. Just as a reminder, those numbers carry a lot more value than your analysis.
Critical analysis of these slides: http://electroiq.com/blog/2014/01/intel-vs-tsmc-an-update/
It's a good read imho.
While reading parts of TSMC's annual report, I didn't see any other kinds of production. It's the most likely assumption.
That size difference between sram configurations would still be unusual, especially since...Firstly, he is assuming that 14nm and 22nm are more than marketing labels; they're not. Second, his math is incorrect. If the trend is 0.5x per generation, the math is very simple: 0.5 * 0.092 = 0.046. Intel, however, is claiming more than a 0.5x reduction, somewhere around 2.2x the size, or ~0.45x. This would correspond to a cell size of 0.042um2.
...the same project also analyzed 6T-111 Srams, the (theoretically) smaller HDC Srams, and mentions:Additionally, the TRAMS project he cites has a different SRAM configuration that the one Intel used on its 22nm process, and it is therefore not comparable.
- This solution removes one pull-down fin on each side.
- Area Update (June 2012): Due to dominating IM2 via spacing rule, this has no effect on area.
Meanwhile, TSMC plans to set up a special R&D unit, which will be powered by 300-400 technicians, to develop 10nm processes, aiming to push the process into trial production in 2015 and mass production in 2016.
Are they riding exercise bikes connected to generators?
A projected full fab utilisation for 5+ years equals a lot of low risk cash. And ~360k wafer starts per month on 28nm alone is close to what Intel produces in total. Just as a reminder, those numbers carry a lot more value than your analysis.
Critical analysis of these slides: http://electroiq.com/blog/2014/01/intel-vs-tsmc-an-update/
It's a good read imho.
And why would Apple or Qualcomm ever use Intel? The ARM crowd is desperately trying to get away from the old days of the Intel monopoly and throwing more money at Intel at the expense of TSMC, Samsung, and GF is counter productive to the overall health of their own future.
The authors got the gist of it correct but they got the node wrong.
The second-shift for R&D development was pulled together for accelerating 7nm, not for 10nm.
10nm is being handed off from development team to process xfr team at this time in preparation of production.
It isn't really shrinks unless TSMC, GlobalFoundries, UMC, etc are adopting EUV + 450mm.What's the caveat here, IDC?
And why would Apple or Qualcomm ever use Intel? The ARM crowd is desperately trying to get away from the old days of the Intel monopoly and throwing more money at Intel at the expense of TSMC, Samsung, and GF is counter productive to the overall health of their own future.
Source? That sounds ridiculous to me. OEMs just take the best SoC they can get for their money. If Intel asks too much, they'll go with Qualcomm. If they stay with ARM, soon they'll have to use tech that Intel's been shipping for many years, so they'll have no choice if they want to have a competitive SoC.
So to answer your question (I don't know why you mention Qualcomm), Apple will use Intel simply because they (will) have the best SoCs. Why would you use a 20nm SoC if there is 14nm, 10nm and 7nm?
Further cost and size compares between TSMC and Intel for 2015 and 2016.