I figured it out PontiacGTX. You both ignored both my post and and the 2400G video. Turns out that AMD for whatever reason, though my guess is severe hotspot's with the GPU portion vs. the CPU portion caused AMD to be worried about Solder fractures, decided to use a Thermal Paste instead of Solder for the G chips. I hope they continue to use Solder on Ryzen 2k and TR2.
That is what the discrepancy is about. Which brings me back to my point, the Solder implementation on Ryzen was so good that there was only a 1C difference between lidded from the factory and direct die cooling.
That is what the discrepancy is about. Which brings me back to my point, the Solder implementation on Ryzen was so good that there was only a 1C difference between lidded from the factory and direct die cooling.
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