Originally posted by: Tiorapatea
From the horse's mouth, Prescott specifications and thermal design considerations...
Specs
Thermal and mechanical design
I wish I could understand a little more in these documents. It seems to me like Prescott, well, uh, runs a little hot and, like, there's lots of stuff you have to do to keep it happy. Also, it looks like 2.8A (the 533 FSB proc.), 2.8E and 3.0E aren't designed with the same electrical specs as 3.2E and 3.4E.
Anyone care to explain how VID, Vccmax, Icc etc. move around and interact when overclocking. Am I correct in saying that with these newer multiple VID processors, you want to get lucky with a low voltage chip for its rated speed to give you more headroom to overclock?
References please in layman's terms as to how you stay in touch with Intel's design specs for processors (more or less) while o'cing. I mean I keep reading about upping the FSB and voltage and waiting to see if your system crashes but isn't there a slightly more scientific way of estimating what you might get out of a CPU (without frying it) ex ante., i.e. along the lines of saying: ok, I have a 2.4C, M0 stepping with VID at 1.425V so if I overclock by amount x, increasing voltage by delta, and then take y and z measurements, then I'll have an idea that the CPU could maybe go as far as [some extrapolated GHz] or I can at least predict some safe further increment to the overclock/voltage while staying within Intel's thermal design guidelines? Hope this makes sense.
No. Supply and demand could easily force chips that normally performed much higher, into a lower bin, because of demand. Or demand for a higher clocked processor could have lower binned processors capable of higher speeds put up into the upper speed bracket.