- Sep 18, 2011
Even though I do think the GloFo Zen 3 is real, I totally agree with this. I'm not sure why AMD thinks this is a market worth spending resources on even if GloFo wafers are cheap. Dali does need to be upgraded if they are going to continue with it though.
GloFo Zen3/Monet is definitely not real.Cue Monet.
4c Zen3 & 3+ RDNA2 WGPs at a goliath-size of 250+ mm2.
When Dali/Pollock is directly succeeded by Mendocino.
Family 17h 20h-2Fh -> Family 17h A0h-AFh
0x820F00 -> 0x8A0F00
FP5/FT5 128-bit/64-bit DDR4-2400 -> FT6 128-bit/64-bit LPDDR5-6400
14nm Dual-core Zen/GCN CUs -> 6nm Quad-core Zen2/RDNA2 CUs
From a cost-perspective there is no expected cost increase going from Dali/Pollock's $300 range to Mendocino's $300 range. However, Mendocino's $200 reach is more cost-prohibitive, hence Mendocino's increased salvaged die capability.
However, AMD is technically using different edges between Stoney and Raven2/Mendocino. Where Stoney is quite literally designed and taped out at the end.
28nm design in 2011 -> Stoney design start 2014 -> Stoney prod in 2016
For perspective, if it occurred the same with 22FDX:
22FDX(Milestone 6) design in Q4 2016 - Q1 2017 -> Equivalent time frame is 2020 design start -> Production in 2022.
However, it might make sense to only design once trailing-edge IP catches up with leading-edge IP. Allowing for DDR5/PCIe5/USB4 to be on die, while only launching with DDR4/PCIe4/USB3.2. So once in the case of DDR5/LPDDR5 getting cheaper, it only takes a refresh(same maskset) to enable it.