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True. I am not denying that. It’s just AMD needs to have better communication. On July 15th they said it’s launching by 31st of June. So in just one week they found out that testing wasn’t done properly.No, CPU design and manufacturing is just complicated.
These companies are packed with talented and highly professional people, yet things go wrong from time to time. This (Zen 4/RPC) gen should be very indicative of that.
That s not a more efficient condition, rather the contrary since mosfets are slower at very low temps, the higher the temp the more the transconductance up to a given temp, generaly in the 100-120°C range, at wich the conduction and speed at a given voltage start to decline, it s just that under LN2 you wont overheat the chip with a hugely over specced TDP.
Actually at -100°C you need to pump higher voltage to reach the same frequencies than at 50°C, and as already said i dont believe that the 9950X has only 3.85% better 7 Zip perf than the 7950X, this very number just doesnt make sense.
Edit : Methink that in reviews the CBR23 score will be up to 10% higher and the 7 Zip one 15-20% higher, AMD stated perf improvement over the 7950X is 22%.
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Ryzen 9000/AI 300: Details zu Zen 5, RDNA 3.5, Zen 6(c) & Zen 7
Ryzen 9000 kommt am 31. Juli. Schon heute gibt es weitere technische Details zu den Desktop-CPUs und Ryzen AI 300 Strix Point für Notebooks.www.computerbase.de
22% is for Blender, not CB R23. They gave a specific 17% IPC uplift for R23. That will not change. At least for ST, all you need to do is extrapolate the score vs 7950X and you will have the score for 9950X. 2050*1.17= ~2398That s not a more efficient condition, rather the contrary since mosfets are slower at very low temps, the higher the temp the more the transconductance up to a given temp, generaly in the 100-120°C range, at wich the conduction and speed at a given voltage start to decline, it s just that under LN2 you wont overheat the chip with a hugely over specced TDP.
Actually at -100°C you need to pump higher voltage to reach the same frequencies than at 50°C, and as already said i dont believe that the 9950X has only 3.85% better 7 Zip perf than the 7950X, this very number just doesnt make sense.
Edit : Methink that in reviews the CBR23 score will be up to 10% higher and the 7 Zip one 15-20% higher, AMD stated perf improvement over the 7950X is 22%.
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Ryzen 9000/AI 300: Details zu Zen 5, RDNA 3.5, Zen 6(c) & Zen 7
Ryzen 9000 kommt am 31. Juli. Schon heute gibt es weitere technische Details zu den Desktop-CPUs und Ryzen AI 300 Strix Point für Notebooks.www.computerbase.de
Static power is reduced because the lower transconducatnce imply lower leakage but that also mean lower speed at a given voltage.Temperature decrease reduces all of the conductor and channel resistances as well as decreases the static power consumption of the FETs. So your RC delay goes down and your static power goes down. In turn, the CPU will consume less power as the temperature is decreased, all else being equal, and will lead to more efficient performance by the CPU.
Without CB testing a 9950x, you shouldn't compare their 7zip results with AMD's as evidence that AMD's stock test is under performing. Too many variables come into play.
The 22% in the slide i linked is a global number comprising an average of several benches, that s in AMD s footnotes.22% is for Blender, not CB R23. They gave a specific 17% IPC uplift for R23. That will not change. At least for ST, all you need to do is extrapolate the score vs 7950X and you will have the score for 9950X. 2050*1.17= ~2398
Static power is reduced because the lower transconducatnce imply lower leakage but that also mean lower speed at a given voltage.
Beside the conductors resistance shouldnt be significant at currents required to hit 5GHz, the RC delay getting lower wont automaticaly compensate for the lower transconductance that will increase the time required to charge the parasitic capciatances of all kind (wich are left unchanged by the low temp).
Some people on Xitter are saying it might be a packaging issue, whatever that means. Obviously, that's not in reference to the box the CPU comes in, although it would be funny if the issue was to fix a typo on the box (gotta remove that "+32% IPC" claim
Some people on Xitter are saying it might be a packaging issue, whatever that means. Obviously, that's not in reference to the box the CPU comes in, although it would be funny if the issue was to fix a typo on the box.
That’s not what hardwareluxx is reporting. It’s also a hardware issue.According to AMD, it is not a design or packaging issue, but that they discovered that not all chips that were sent out went through QA, so they are sending out new chips to make sure they were properly tested before being sold/reviewed. See post #16,557.
Edit: If it was an actual issue with the chips, there's no chance they would be able to get them fixed and new ones out the door within a week or two. It would have to be either the QA testing miss as explained, or something wrong with the microcode/firmware that they could fix and push out quickly.
Maybe. Ryan seems to think it's a packaging issue as well:According to AMD, it is not a design or packaging issue, but that they discovered that not all chips that were sent out went through QA, so they are sending out new chips to make sure they were properly tested before being sold/reviewed. See post #16,557.
Edit: If it was an actual issue with the chips, there's no chance they would be able to get them fixed and new ones out the door within a week or two. It would have to be either the QA testing miss as explained, or something wrong with the microcode/firmware that they could fix and push out quickly.
More info, translated:That’s not what hardwareluxx is reporting. It’s also a hardware issue.
Not sure if this affect later Zen4, but the 3 7900x retail samples I got in Feb2023 that had ihs dated Jul-Aug 2022 all failed single thread corecycler AVX2 ycruncher/p95 at stock clock with no pbo or curve optimizer.Do you remember the launch problems of Zen 4 and burned burned sockets? Maybe AMD simply prefer a launch without bugs, as in September no one will remember if it was a late July or early August launch. They will however remember if their CPU is not working.
Conductor resistance is a big deal on advanced nodes and channel mobility increases with lower temperature, it's not just the conductors.
I mean, we have direct tests of power use vs. temperature and decades of practical overclocking experience to tell us that your theory is not correct. I honestly thought this was just established knowledge at this point, at least in overclocking communities.
Maybe. Ryan seems to think it's a packaging issue as well:
More info, translated:
Quality problems ensure a complete recall of the samples and also of the processors already delivered to the trade. All processors already delivered initially will therefore be replaced by a fresh production badge. AMD does not provide any information exactly which quality problems have occurred. But apparently it is a hardware problem that cannot be fixed by software.
They said that cold bug for the 9950X occur at -130°C, it means that at this temp the device is just too slow to work, wich say that at extremely low temps lowered transconductance has more impact than the lower resistances.
It s just that under LN2 they must make sure that the silicon reach a minimal temperature to be functional, because even with LN2 it will be way over this temp once it booted and is somewhat loaded.
I don't think the analog part is really a concern with modern CPUs, so it's most likely a hold time violation as the timing paths shift too far with the extreme temperatures and the data misses the edge window of the flip flop and fails to propagate to the next stage. It's not running too slow, the timings just weren't designed for that cold of operation.
Sure we can! This is the Internet!You can't get pissed about that.
But for time violation or interstage propagation to be too slow something has to limit the speed at wich the transistors are switching since lower resistance are supposed to help...
This means that the parasistic capacitances cant be charged fast enough, that is, that the provided current are too low, wich get us back to too low transistors conductance, actually low temp would be an advantage for higher speed if it werent for the transistors worse characteristics under this condition.
Yep, Im happy AMD is doing this. Cooled down a bit and a yeah better do it now and have a smooth launch.All I can add, is after the Intel fiasco, AMD wants to be SURE there is nothing at all wrong with what they send out, even if it causes a slight delay. 2 weeks is a slight delay. You can't get pissed about that.
Amen, brotha.Sure we can! This is the Internet!
If we can't have our daily drama... life becomes rather dull...Sure we can! This is the Internet!
Timing violation does not mean too slow, it just means off. It can also be too fast. Flip flops need a narrow window for the signal to be present and held in. If the signal is too early, it will also be a timing violation.
A hold time violation cannot be fixed by lowering the frequency (i.e., the signal is propagating too quickly), hence a cold bug will still be there even if you down clock as low as possible. Again, your theory is wrong.
I never use such sentences, i mean such arguments or rather lack of, you know, things like "it s well known that", "it s shown in real world tests" and so on.You can argue all you want, but real world tests have shown that it is not correct.