Current 360 chips are manufactured using 45nm. If the XBO is manufactured at 40nm, and has 10x the transistors compared to 360 (according to MS), then that means that the XBO chip is going to be 8x larger than the 360 chip. That means 8x more expensive, along with a bunch of other negatives that come from large die sizes.
If the XBO chip were to be manufactured at 32nm (which I think is extremely reasonable), then it would be only 5x larger than the 360 chip. Still not great, but not as bad as at 40nm. At 28nm it would be only 3.8x larger than the 360 chip.