I think I found the answer here:
https://www.micron.com/about/blogs/2015/may/addressing-data-retention-in-ssds
So I am thinking (all things being equal) the 3D TLC NAND in question was lower bin than the 2D TLC NAND and also optimized for performance and endurance rather than data retention.
That depends, both drives were pretty worn when these tests were run (like 80% of P/E cycles used for the one using 3D TLC NAND and 90% for the one using 2D TLC NAND).
So, both have seen some wear but the number of P/E cycles used is different since they're not specified for the same number of P/E cycles with the drive using 3D TLC NAND (unsurprisingly) the one with the higher endurance.
The same 3D TLC NAND is supposedly able to handle significantly more wear than this particular drive is specified for so it may not be the best binned NAND.
At the same time this was a pretty steep drop so we'll see how even this bit more conservative estimate will save it from any corruption.
It may be the other way around with the drive using 2D TLC NAND however since it still holds up pretty well.
In fact it performed about as well at 90% wear as it did before even a single P/E cycle was consumed which is also not something you'd be likely to think would be the case with 2D TLC NAND (at such a small lithography).
Worth mentioning is also that the drive using 3D TLC NAND was worn out more quickly (from 0% to like 80%) while the other had retention tests at 25,50 and 75% before reaching 90% wear and as mentioned that might have worked in favor of the drive using 2D TLC NAND.
Not sure how much of a difference it would have made though.
And of course there's also the fact that there's several factors determining how a drive is going to behave.
For example 2D FG does not behave like 3D CT or even like 3D FG.
Even just the controller and how well tuned its algorithms are can make a pretty big difference.
So maybe a SSD controller with a higher amount of channels could help? (re: more NAND used in parallel would more easily hit certain write targets)
Two examples I am thinking of right now:
1. PCIe 3.0 x 4 quad channel controller with four packages (each with four 64L 512Gb 3D TLC dies)
2. PCIe 3.0 x 4 octa channel controller with eight packages (each with four 64L 256Gb 3D TLC dies).
Of the two options above the second one has 2x the parallel at the same capacity. So for #2 I am thinking it could either have 2x the write of the first option at the same endurance and retention.....or it could be tuned for the same level of write with either greater endurance or retention (or some combination of both greater endurance and greater retention).
If that is true, I also wonder how a PCIe 3.0 x 4 quad channel controller with four packages (each with four 64L 512Gb 3D MLC dies) would compare? Or maybe how a PCIe 3.0 x 4 sixteen channel controller would factor in (with various combinations of NAND)?
I think that should work, though I'm not entirely sure of exactly how it works.
Here's some info related to that however:
"Regarding point two, it is known for NAND Flash memory that damage created with each p/e cycle partially recovers or heals during the delays between p/e cycles (see JESD22-A117).
Therefore, an endurance stress test that is performed over just a few weeks results in more net damage than would be experienced in normal use over several years.
The main effect of this higher net damage is to reduce the data retention capability compared to the capability that would exist in real use."
JESD218B-01
"The degradation rate of EEPROM products may depend strongly on the cycling frequency.
That is because some cycling-induced damage mechanisms exhibit partial recovery in between cycles; increasing the cycling rate may prevent that recovery and lead to early failures.
Typical recoverable degradation mechanisms are the detrapping of charge trapped during cycling in the transfer-dielectric layer of floating
gate devices, or detrapping of excess trapped charge in trapping-based non-volatile memories."
JESD22-A117C