Does anybody know if Intel continuously improves their process as time goes on (or do they just work it until it is great, set it and forget it?). If they improve as time goes on, it makes sense they'd want a high-volume, but lower-bin (to improve yields) product to be "pipecleaner" for newer processes.
Way out of my area of expertise, but that would explain why they go for mainstream products on the new process first.
There's two kinds of "yield" from a high-level perspective.
There's
parametric yield (clockspeeds and power-consumption binning) and then there's
functional yield (defectivity, does it add 2+2 and get 4, etc).
^ addresses improvements in functional yield, not parametric yield.
Regardless, the short answer is yes, they do. Everyone does. When AMD did it they publicly referred to as CTI. I don't know of an IDM or foundry that doesn't actively seek to improve parametric yields. (or functional yields for that matter.
And Nemesis, the phrase you are seeking is "copy exact". Intel has had a copy-exact philosophy for fab alignment since the early 90's IIRC. Intel is not alone in this policy, it's industry wide but it varies from company to company in terms of just how "exact" the copy exact need be.
What generally happens is that you qualify multiple sources (be it the toolsets or the chemical suppliers) and then you "copy equivalent" from fab to fab in ways that are cost conscience.
There is no sense in requiring the fab in Israel to use the exact same source supplier for DIW or phosphoric acid as the fab in Oregon if a local supplier can provide equivalent product that meets the spec requirements.
But you can be sure they both will use the exact same make and model of immersion litho tools at $30m a pop.