The notable others have to "sell" their processes to clients, which makes the development processes more open. Which is why we know that while GloFo is working on a finfet design, they won't ship it for at least 2-3 years.
So, while yes, the others will eventually catch up to Intel, there's going to be some painful 2 years during which AMD will (again) have to try and compete against a product built with fundamentally better process.
2-3 yrs is generous. Those who work with this stuff are saying it'll be more like 5 yrs.
Look at the gap between Intel's debut of HKMG and that of AMD/GloFo. (It will be nearly 4yrs)
The technological barriers that must be surmounted in order to implement FinFET make implementing HKMG look trivial. I will be quite impressed if anybody else in the industry is shipping FinFET enabled IC's before 2017.
The primary challenge and biggest issue is simply money. It takes money, ridiculous amounts of it, to run the sort of development program that Intel operated in order to bring their FinFET's out of the laboratory and into a production environment (and we've yet to see if it is actually manufacturable, 22nm isn't released yet for a reason).
It is one thing to say "IBM and GloFo will likely have FinFET at 14nm" and quite another for IBM and GloFo to conjure up the billions and billions of R&D dollars that are necessary to get it done in 5yrs, let alone the money it would take to do it in 2-3yrs.