Hoho, somehow I missed the leak from Chiphell Forum. Just want to add the Universal Compression of RDNA5:
a significant enhancement to reduce memory bandwidth needs by compressing virtually all graphics data, not just textures, enabling faster performance, lower memory requirements for 4K/higher gaming, and boosting upscaling tech like FSR. It works by applying compression across the entire GPU pipeline, leveraging increased silicon speed to overcome traditional performance costs, thereby increasing effective memory bandwidth and improving efficiency for next-gen gaming experiences.
Double SP Per CU + Universal Compression, HOHO
Above table including RDNA5 leaks from MLID with my speculated/missing SKUs with question mark?. As I said AT1 is being cancelled because AT2 full die with faster GDDR7 should be competitive with Rubin-70Ti. Oh yeh, all other OEMs have already implemented 128SP per CU; I really hope you guys do more homework before commenting.
Microsoft is rather paying for 408mm2 wafer than custom designing their own APU cause development cost of 3nm APU costs hundreds of million. Only Sony with high sales volume is able to custom their APU with smaller die area: ~ 280mm2. Hoho, I let you guys think why do I mention these...
One more hint: 7800XT (N32, 60CU) -> 9070XT (N48 XTX full die, 64CU). Why do AMD downgrade the N48 to 70 series?
In conclusion, AMD has only prepared 2 RDNA5 dies: AT0 and AT2 for dGPU lineup and we should forget about mobile GPU lineup. Meanwhile AT3 and AT4 are being used for mGPU with CPU SoC which is selling in laptop for $1500 above, not cheap dGPU. Geez.
Anyhow, RDNA5 lineup going to be mighty impressive as I speculated in Soundwave thread: the Radiance core will be 3 times faster per core, thus AT2-80XT with 64CU's RT should be 2.x times faster than RDNA4's 9070XT (64CU) depending on the clock speed and features.