Discussion Leading Edge Foundry Node advances (TSMC, Samsung Foundry, Intel) - [2020 - 2025]

[DisEnchantment]

TSMC's N7 EUV is now in its second year of production and N5 is contributing to revenue for TSMC this quarter. N3 is scheduled for 2022 and I believe they have a good chance to reach that target.


N7 performance is more or less understood.


This year and next year TSMC is mainly increasing capacity to meet demands.

AnandTech Forums: Technology, Hardware, Software, and Deals

Seeking answers? Join the AnandTech community: where nearly half-a-million members share solutions and discuss the latest tech.

www.anandtech.com

For Samsung the nodes are basically the same from 7LPP to 4 LPE, they just add incremental scaling boosters while the bulk of the tech is the same.

Samsung is already shipping 7LPP and will ship 6LPP in H2. Hopefully they fix any issues if at all.
They have two more intermediate nodes in between before going to 3GAE, most likely 5LPE will ship next year but for 4LPE it will probably be back to back with 3GAA since 3GAA is a parallel development with 7LPP enhancements.

AnandTech Forums: Technology, Hardware, Software, and Deals

Seeking answers? Join the AnandTech community: where nearly half-a-million members share solutions and discuss the latest tech.

www.anandtech.com

Samsung's 3GAA will go for HVM in 2022 most likely, similar timeframe to TSMC's N3.
There are major differences in how the transistor will be fabricated due to the GAA but density for sure Samsung will be behind N3.
But there might be advantages for Samsung with regards to power and performance, so it may be better suited for some applications.
But for now we don't know how much of this is true and we can only rely on the marketing material.

This year there should be a lot more available wafers due to lack of demand from Smartphone vendors and increased capacity from TSMC and Samsung.
Lots of SoCs which dont need to be top end will be fabbed with N7 or 7LPP/6LPP instead of N5, so there will be lots of wafers around.

Most of the current 7nm designs are far from the advertized density from TSMC and Samsung. There is still potential for density increase compared to currently shipping products.
N5 is going to be the leading foundry node for the next couple of years.

For a lot of fabless companies out there, the processes and capacity available are quite good.

---------------------------------------------------------------------------------------------------------------------------------------------------


FEEL FREE TO CREATE A NEW THREAD FOR 2025+ OUTLOOK, I WILL LINK IT HERE

 

[mikegg]

Seems odd that in his post he said the external customers with Intel 18A will be HVM in 2028-2030. I’m pretty sure that should be 14A/-E.

That seems to make sense. No one is going to put their flagship products on Intel 18A. That's way too risky. Companies will put their 2nd/3rd tier products on 18A and those can use a non-leading edge node.

 

[jdubs03]

That seems to make sense. No one is going to put their flagship products on Intel 18A. That's way too risky. Companies will put their 2nd/3rd tier products on 18A and those can use a non-leading edge node.

Maybe? That’s where that reputation of reliability comes into play. Clearly, they’re gonna need to prove themselves if they want leading edge output.

But I still will reference this as the baseline scenario:

That to me reads as 1st/2nd tier, depending on the version of the M-series on 18AP. The rumor for A-series in 2028 is base on Intel 14A, Pro on TSMC A14.