P.S. I didn't know that AS5 settles out
anyway to stop that? I bought a 12gram tube so I have lots left over lol
The issue of thermal pumpout was covered by AMD for XP processors in 2003:
>>>For permanent installation AMD only recommends using phase change material with the heatsink/fan. No thermal grease is recommended for anything other than temporary evaluation purposes. And the only thermal grease recommended for that is Shin Etsu G 749. Artic Silver is made up of a matrix with conductive particles. There is the possibility of creating electrical shorts on the package. Any failed processor used w/ Artic Silver or any other thermal grease other than Shin Estu G 749 would be subject to warranty voiding. The concerns with other thermal greases are due to thermal pumpout causing overheating with on off cycling of the PC over time. The above information assumes you are referring to use with Athlon. For Opteron Shin Etsu G 749 also is the only thermal grease recommended for permanent installation. Again the concern is due to pumpout with thermal cycling.<<<
http://www.amd.com/us-en/assets/content...Thermal_Material_vendor_list_ENG-S.pdf
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With the A64 processors AMD approved thermal compounds :
>>>Thermal Interface Materials for AMD Opteron? and AMD Athlon? 64 Processors
AMD evaluates thermal interface materials for use with its AMD Opteron? and AMD Athlon? 64 processors. A list of suggested materials is provided in the table below.
Suggested Thermal Interface Materials Manufacturer Interface Material Material Type
Bergquist TIC-3000 Grease
Shin Etsu G751 Grease
Shin Etsu X23-7762 Grease
Shin Etsu X23-7783D Grease
Thermoset, Lord CPD TC-350 Grease
The heatsink makes contact with the top surface of the processor package utilizing the thermal interface material between the processor lid and the heatsink. AMD recommends using a high-performance grease such as those listed in the table above. AMD does not recommend using phase-change materials between the heatsink and the processor.
Phase-change materials develop high adhesion forces between the heatsink and processor when the material is in the solid phase. This strong adhesive force may cause the processor to stick to the heatsink. During heatsink removal, this strong adhesive force may cause the processor to be removed from the socket while it is locked, and this action may result in damage to the socket or to the processor pins.
Most grease should be applied in a 34 - 35 mm square that is 0.06 - 0.08 mm thick. This amount of grease has provided good coverage of the processor lid while not being excessive. If excessive amounts are applied, grease may flow over the edges of the processor and reach the socket . This is not desirable.<<<
I haven't used the Bergquist TIC-3000 Grease or Thermoset, Lord CPD TC-350 Grease...but Shin Etsu compounds take some technique to apply. I think if the Shin Etsu compounds were easier to apply then they would have a problem with thermal pumpout.
Shin Etsu compounds are fairly thick, without much evaporative chemical. Shin Etsu supplies the electronics industry, and is focused on performance and reliability.
As the old Dans Data toothpaste review shows lots of materials [ including ground diatomaceous earth [ silicon from Diatoms ] in toothpaste or yeast fermentation by-products in Vegemite...both in a water based paste ] can post good temps, for a while.
The trick is making a compound that works for years, doesn't pumpout, doesn't corrode, doesn't damage components, and still delivers top perfomance
G751 has varied and larger particle sizes in a thick paste that has a viscosity and consistency much like wood putty..but it works great for chips like GPU's and Northbridge which may not be flat or smooth...and it works well with rough finishes on heatsinks.
Larger particles fill in rougher surfaces better, and in combination with a more viscous formulation, fill in larger gaps and stay put.
X23-7783D has smaller particles, and the particle size is very uniform, and it easier to apply and works well on CPU's, especially newer processors with larger packages, and it woks well on lapped chip/heatsink combinations.
Smaller particles fill in a smooth surface better, and a less viscous formulation with some evaporative chemical spreads thinner and gets even thinner after burn-in ...yet still avoids thermal pumpout.
Shin Etsu applies much better when warmed, and a thin layer [.06mm] works best. The thermal compound doesn't spread as easily, but that is why it stays put.
During thermal cycling, [burn-in] the small amount of evaporative chemical leaves and the boundary layer gets thinner, but more importanly the particles fill in the surface irregularaties and any remaining air leaves the interface.
Thermal Interface materials seem to be like motor oils, easily marketed with lots of hype.
I choose products based on engineering and testing. Good materials, and testing help to determine the best overall choice for a given application.
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