Originally posted by: Idontcare
You are thinking of
EUV, but current thinking is that it won't be necessary (or manufacturing ready) for 22nm (see links in the posts in that EUV link).
Earliest intro timeline for production is 16nm at the moment.
Bear in mind though that this means EUV needs to be "ready enough" to be capable of supporting 16nm process development teams in about 4 months time.
Current fab tech is capable of 22nm, provided we require current fab tech to include high-NA immersion litho combined with dual-patterning integration
But 22nm won't require anything more exotic materials-wise than an evolutionary iteration of planar HK/MG and ULK/Cu used for 32nm. We might see Cu contacts come into play at 22nm (dual-damascene M1).
All the exotic 3D stuff (mugfet, finfet, etc) won't be on the table any sooner than 16nm. eDRAM will likely be there though.