He seems pretty cool. Was tired of studying so I decided to give part of the video a watch before I go to sleep. Ye he seems pretty confident about Intel 4's health, something interesting though I heard Tom mention was that there were 12 steppings? of MTL. Sounds crazy, but idk if Tom lifted that off SPR since apparently it also had 12 steppings. I mean I wouldn't be surprised if MTL required a bit more work, but idk if it was as bad as SPR.What is the board's opinion of Daniel Nenni (SemiWiki founder)? I know MLID is not popular (for understandable reasons) but he somehow gets these really credible guests on his podcasts that I think are worth a listen.
Anyway, his statements on Intel's foundry services is interesting. As a summary: He says Intel 4 & 3 are both already solid. He seems confident in 18A too, although claims it's success is dependent on the PDK they offer. He thinks IFS offering for Intel 3 is basically DOA against TSMC since they can't compete against their current ecosystem and PDK. Seems Intel's issue with MTL-S (presumably being cancelled) aren't necessarily related to the manufacturing side but rather first adoption of chiplets and early EMIB bugs.
He thinks TSMC 2nm is ahead of Intel 18a but are comparable, and those two are comparable to Samsung 3nm
He disagreed with Tom saying that Nvidia was going to cancel MCM and only focus on mid range of gaming chips lmao, so I'm glad I heard that
The part where he talked about how demanding Apple was for TSMC and how Apple, AMD, and Xylinx? I think it was, played the largest role in TSMC developing packaging tech was interesting
Finfet is much easier to design for than gate all around, so perhaps that's part of the reason Intel is able to push out ARL on TSMC 3nm faster than they can get ARL on 20A (second part is speculation on my end)
Intel 7 ultra is ridiculously expensive according to Tom, more expensive than TSMC 7nm but also more expensive than TSMC 5nm!
Daniel seems insistent that large, chiplets for expanding max die size (Intel possibly Nvidia) is worse than AMD's method of many small chiplets with better yields
Based Intel 18A, cringe Intel 3, Samsung sucks in general
Also MTL doesn't use EMIB afaik just foveros
Interesting vid.