IMO the article is garbage anyways because they are attempting to frame this as MCM vs monolithic, but it isn’t, it is purely about die size and die characteristics. Do you think if I take my custom design to TSMC they are going to ask me if it is MCM or not? No, they are going to give me a quote and call it a day.
Intel and AMD both know the cost + benefits of both approaches. We see the direction they are going in.
Intel and AMD both know the cost + benefits of both approaches. We see the direction they are going in.