This is to be expected when competition diminishes in an industry. We have three players left with leading edge nodes: TSMC, Samsung, and Intel. At the moment, TSMC has volume in the industry's best node (N5), Intel has low volume with a node that could be considered second best (10sf), and Samsung has volume with their 8nm node and is risk with their next (from memory, could be wrong) node. GloFo has bailed on anything past 12LP+/22FDX/12FDX. Other foundaries are way way behind. Couple all that with a market demand that is outstripping supply, and how very difficult it is to move from one foundary to another, and I'm shocked that prices haven't skyrocketed.
If the trend continues, second tier chips will make sense on trailing nodes over doing smaller dies on new nodes. So, for example, instead of making the 3300x/3100 on N7 with die recovery, they could have done an APU on GloFo 12LP+ as a sort of "half Renoir", 4 cores, 4MB L3, Zen2, VEGA4, etc. It would have been similar in size to Raven Ridge, but on a now cheaper node. AMD is showing that they have no problems with using different core generations in a CPU family generation with the upcoming 5000 series APUs. They have already shown that they will use different nodes in a number generation with the 3000 family APUs on 12LP, and the desktop products on a mixed node package. AMD would have also been much better able to supply the market with product with more sourcing from GloFo, and a half Renoir should be a better performer than the existing 3000 series APUs, save for gpu performance, though that wouldn't be as big of a deal in that segment.
As for Intel, and the point of this thread, I don't see them ever sourcing any of their Lakes products from someone else. It's still designed based on their old strategy of marrying a design to an in house node as far as I've ever read.