That has the making of an epic conspiracy theory article on S/A 😱
"Intel: POE (Planned Obsolescence Engineering) Behind Switch to TIM-Based CPU Packaging!"
:sneaky:
I thought my previous comment about the TIM in the chip drying up causing heating issues was more of a realistic situation then a conspiracy.
intel are going to artificially stimulate the CPU market now the desktops are in decline.
Make the CPU's burn twice as bright for half as long.
Desktops are not in decline, they are the largest seller.
Desktops are not in decline, they are the largest seller.
However, mobile devices yearly sales are currently GROWING at a faster rate (while being much smaller figure overall).
Furthermore, if you SUM all the mobile devices (laptops, tablets, netbooks, and smartphones) you get an aggregate figure larger then that of desktops. (similarly as to how people often sum up the PS3, xbox360, and wii to get a larger figure than PC sales despite the fact that the PC has more in common with the xbox360 then either the PS3 or the wii).
Some analysts who were dropped on their head as babies have thus extrapolated (completely ignoring market saturation or the fact that you should not sum disparate devices such as laptops and phones) that this growth rate will continue infinitely and thus eventually mobile devices will outsell desktops...
And for some reason too many suits at the top of some companies are eating this nonsense up 🙄
There was a time when AMD CPU's could use the same CPU socket and motherboard as originally designed for Intel's Pentium CPU.
Well, maybe AMD could make some updated 28 nm lowered-voltage socket 1366 compatible CPU's, if Intel is too focused on their crispy trigate CPU "innovation" to bother with. Combine with updated PCIe 3.0 & USB 3.0 support in a new revised "x58-A" chipset motherboard. A bios update could allow the lower powered (and cooler running) AMD CPU to work in existing x58 chipset boards, but you just wouldn't get the PCIe 3.0 or USB 3.0 when used in those boards.
Anyhow, planar transistor designs will still be around for a long time yet. Especially if Intel doesn't plan on licensing their trigate transistor patents to competitors, such as AMD, nVidia, Qualcomm and others.
It doesn't have to be a conspiracy. It seems they used the TIM to simply limit the thermal performance of the chip. Hopefully the 6 core Ivy-E chips use solder. I'm drooling over the idea of a 4.8ghz, 60-70c Ivy with 6 cores. Dreaming maybe...
Intel using paste should make it easier to delid than the old chips that required heating up the solder with a torch to pop the cap. I plan on going water any way with my Ivy build, but I don't know if I have the cajones to pop the cap on my new $350 cpu. I have done it on older chips in the past and I have lapped most all of my CPUs. I will see what sort of temp issues I have first I suppose. I am a tad concerned to know they use TIM instead of solder though. Especially since they likely use the cheapest TIM they could find. I expect there to be issues down the road with drying and cracking. It would be nice if they offered the K-version chips with the option of soldered IHS. It would be worth a $10 premium even IMO.
I see that as being easily achieved. Your talking really mature silicon when the server chips arrive. Look at IB its down to 10 watts . So ya I think you workstation guys are going to get great chips . Even tho us on lowly haswells will be kicking IB ass in gaming and any task that are AVX II compiled
Oh my... Where would they get the resources for that?! How do we sustain an infinite population?!
And actually laptop sales eclipsed desktop awhile ago. 2008 in fact:http://www.inquisitr.com/76157/tablets-to-overtake-desktop-sales-by-2015-laptops-will-still-reign/
People like mobile computing more.
I applaud both your own and your company's admission that heat is a problem with Ivy Bridge.
You are of benefit to our community here. Thank you for being nothing like the undercover shills employed by some of your competitors.