I have a FOP32-1 on a Tbird 1.2. Do I just put the thermal compound on the core surface (small rectagular shinny, in the middle), or on the entire chip surface? My Tbird is already unlocked and I'm going to bring it to 1.4G. Right now, it's running 9.5 x 133/33, and the temp is ~40C normal, ~46C after 2 hours of Age of Empires:TC in win98SE. Thanks.
Here is the rest of the system (just put together yesterday), I am really exctited, so let me brag a little bit okay
KT7A-R
40G Maxtor
Elsa Geforce2 GTS 32M
SB Platinum 5.1 with DDT 2500
512M Infineon PC133
8X plextor
and...a $3 modem
Here is the rest of the system (just put together yesterday), I am really exctited, so let me brag a little bit okay
KT7A-R
40G Maxtor
Elsa Geforce2 GTS 32M
SB Platinum 5.1 with DDT 2500
512M Infineon PC133
8X plextor
and...a $3 modem