mechBgon, a small suggestion: your article mentions that users should loop the HSF cable to reduce EMI. AMD suggests to tie it in a serpentine loop or to route the extra cabling directly thru the HSF fins to reduce EMI. Here's what their document #26003A says:
The large loop to the power connector is a potential problem. Shorten this length as much
as possible by routing the cable in a serpentine manner and tying it with a plastic twist-tie.
This solution can reduce emissions by 5 dB. Also, shortening the cable path by routing the
fan power cable through the heat sink fins (to allow more direct routing) can decrease
EMI emissions.
I'd like to point you to the excellent build and installation guide that AMD made for desktop / tower systems. It's called "Builders Guide for Desktop/Tower Systems", document No: 26003A (available at www.amd.com. Suggest you add the link in your resources page for the newbies....
Edit: The link for VIA chipset drivers points to Intel's web page! Has Intel has hijacked your page so soon??:Q :Q
The large loop to the power connector is a potential problem. Shorten this length as much
as possible by routing the cable in a serpentine manner and tying it with a plastic twist-tie.
This solution can reduce emissions by 5 dB. Also, shortening the cable path by routing the
fan power cable through the heat sink fins (to allow more direct routing) can decrease
EMI emissions.
I'd like to point you to the excellent build and installation guide that AMD made for desktop / tower systems. It's called "Builders Guide for Desktop/Tower Systems", document No: 26003A (available at www.amd.com. Suggest you add the link in your resources page for the newbies....
Edit: The link for VIA chipset drivers points to Intel's web page! Has Intel has hijacked your page so soon??:Q :Q
