We can't blame GloFo at this point, we don't know whether this was a "failure to DFM" on AMD's design part or if this was a "failure to meet the parametric targets" on GloFo's process technology part.
The same as occurred with 90nm Prescott. People railed that it was the 90nm process itself that was at fault, until the mobile Dothan parts came out on the exact same process (but different microarchitecture) and the same
90nm process looked golden.
If this is a case of GloFo failing to deliver to their parametric models (leakage specs, driver current specs, etc) then that is a disaster for their foundry model as other customers look for this as signs of credibility going forward with nodes that are currently under design.
If this is a case where AMD failed to properly design for manufacturing (DFM), as Nvidia did with Fermi on TSMC's 40nm, then that is more your garden variety "they done goofed" scenario. GloFo is going to have lots of customers that done goof, all foundries have that, they can't hold their hands and design the chips for the customer so that it can mesh with the reality of the fab environment.
The jury is out still whether or not Bulldozer is AMD's Prescott, but the preliminary info's are not painting a favorable picture.