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Delided, laped 3770K, temp drop 30+, thanks Idont and Ido CARE

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But what I'm worried about is after couple of months if I have to re apply it or not, if I'm using arctic silver that I have.

You are referring to the "pump out effect" and yes you should avoid AS5, NT-H1, MX-4, etc based on this concern.

IC Diamond and liquid pro/ultra don't have this issue.
 
You are referring to the "pump out effect" and yes you should avoid AS5, NT-H1, MX-4, etc based on this concern.

IC Diamond and liquid pro/ultra don't have this issue.

Does the amount of hold down pressure have a large effect on the "pump out effect".
 
Does the amount of hold down pressure have a large effect on the "pump out effect".

It plays a role but not in a primary capacity.

Pump-out comes about because of thermal expansion and contraction as the processor and IHS heat up and cool down.

Push-pumpTIMgap.png


In the schematic above I depict the TIM as uniformally being pumped out across the entire surface of the CPU, the reality is that it only forms little air-gaps in localized places across the die.
 
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