It's been about three weeks since I put IC Diamond between the core and the IHS, and load temperatures are still vastly improved over the stock solution. I will update my old post in a moment to show details-
Thermal Cycling/TIM Failure Test
System Info:
3570K Delidded with IC Diamond between the die and IHS
ZT-10D HSF with Arctic Silver Ceramique between the IHS and the HSF
4.5Ghz @ 1.232v (after vdroop)
Delidded and IC Diamond applied 8/29/2012
After one week:
(9/4/2012)
Ambient temp - 25C
3570K max temps after Prime "blend" for 30 minutes - 67C, 76C, 74C, 73C
After three and a half weeks:
(9/22/2012)
Ambient temp - 22C
3570K max temps after Prime "blend" for 30 minutes - 62C, 72C, 71C, 69C
After about five weeks:
(10/1/2012)
Ambient temp - 22C
3570K max temps after Prime "blend" for 30 minutes - 62C, 72C, 70C, 69C
After lapping IHS and HSF base down to the copper and using Coollaboratory Liquid Ultra in all areas of contact:
(10/2/2012)
Ambient temp - 21C
3570K max temps after Prime "blend" for 30 minutes -
52C, 61C, 56C, 59C
(10/24/2012)
Ambient temp - 23C
3570K max temps after Prime "blend" for 30 minutes -
55C, 63C, 60C, 61C
More results to come...