It's been about three weeks since I put IC Diamond between the core and the IHS, and load temperatures are still vastly improved over the stock solution. I will update my old post in a moment to show details-

__Thermal Cycling/TIM Failure Test__
**System Info:**
3570K Delidded with IC Diamond between the die and IHS

ZT-10D HSF with Arctic Silver Ceramique between the IHS and the HSF

4.5Ghz @ 1.232v (after vdroop)

**Delidded and IC Diamond applied 8/29/2012**
**After one week:**
(9/4/2012)
Ambient temp - 25C

3570K max temps after Prime "blend" for 30 minutes - 67C, 76C, 74C, 73C

**After three and a half weeks:**
(9/22/2012)
Ambient temp - 22C

3570K max temps after Prime "blend" for 30 minutes - 62C, 72C, 71C, 69C

**After about five weeks:**
(10/1/2012)
Ambient temp - 22C

3570K max temps after Prime "blend" for 30 minutes - 62C, 72C, 70C, 69C

**After lapping IHS and HSF base down to the copper and using Coollaboratory Liquid Ultra in all areas of contact:**
(10/2/2012)
Ambient temp - 21C

3570K max temps after Prime "blend" for 30 minutes -

**52C, 61C, 56C, 59C**
(10/24/2012)
Ambient temp - 23C

3570K max temps after Prime "blend" for 30 minutes -

**55C, 63C, 60C, 61C**
**More results to come**...